2001 Nov 02 5

Philips Semiconductors Product specification

860 MHz, 17 dB gain power doubler amplifier BGD885

PACKAGE OUTLINE

UNIT A2
max. cee
1q
Q
max. q1U1
max. U2W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 20.8 9.1 0.51
0.38 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 4.15
3.85 2.4 38.1 25.4
q2
10.2 4.2 44.75 8 0.25 0.1 3.8
bF
P
6-32
UNC
yw
S
DIMENSIONS (mm are the original dimensions)
SOT115D
0 5 10 mm
scale
A
max. D
max. L
min.
E
max. Z
max.

Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;

2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads SOT115D

D
U1q
q1
b
F
S
A
Z
E
A2
L
c
d
Q
U2
M
w
78923
We
e
1
564
P
yM
B
yM
B
1
B
d
max.
97-04-10
q2yMB