2000 Oct 17 4
Philips Semiconductors Product specification
UHF amplifier module BGY2016
APPLICATION INFORMATION
List of components (See Figs 2 and 3)
Note
1. The striplines are on a double copper-clad printed-circuit board (RO5880) with εr= 2.2 and thickness = 0.79 mm.
COMPONENT DESCRIPTION VALUE CATALOGUE NO.
C1, C2 electrolytic capacitor 10 µF; 35 V −
C3, C4 multilayer ceramic chip capacitor 10 nF; 50 V −
C5, C6 multilayer ceramic chip capacitor 100 pF; 50 V −
C7, C8 multilayer ceramic chip capacitor 10 pF; 50 V −
L1, L2 Grade 4S2 Ferroxcube bead −4330 030 36300
R1, R2 metal film resistor 10 Ω; 0.4 W 2322195 13109
Z1, Z2stripline; note 1 50 Ω−
handbook, full pagewidth
MGM861
C8
C6
R2 L2 Z2
C4
C2
VS2 50 Ω
output
C7
C5
R1 L1
C3
C1
VS1
Z1
50 Ω
input
Fig.2 Test circuit.