Philips Semiconductors Product specification

TOPFET dual high side switch PIP3202-DC
MECHANICAL DATA

Fig.4. SOT427 surface mounting package1, centre pin connected to mounting base.

REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT427
0 2.5 5 mm
scale

Plastic single-ended surface mounted package (Philips version of D2-PAK);

7 leads (one lead cropped) SOT427

eeeeee
E
b
A1
A
A1Lp
bc e
A
UNIT
DIMENSIONS (mm are the original dimensions)
E
mm 4.50
4.10 1.40
1.27 0.85
0.60 0.64
0.46 2.90
2.10
HD
15.80
14.80
Q
2.60
2.20
10.30
9.70
D1
1.60
1.20 1.27
D
max.
11
1
4
7
mounting
base
D1
HD
D
Q
Lp
c
99-06-25
01-04-18

1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.

For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.

September 2001 8 Rev 1.000