Philips TDA8566 AN10365 Surface mount reow soldering description

Product data sheet Rev. 06 — 15 October 2007 18 of 21

NXP Semiconductors TDA8566

2×40 W/2 Ω stereo BTL car radio power ampliﬁer

For further information on temperature proﬁles, refer to Application Note

AN10365“Surface mount reﬂow soldering description”

.

MSL: Moisture Sensitivity Level

Fig 13. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Contents

Main 1. General description 2. Features TDA8566 Rev. 06 15 October 2007 Product data sheet 240 W/2 stereo BTL car radio power amplier with differential inputs and diagnostic outputs 240 W/2 stereo BTL car radio power amplier 3. Quick reference data =25 4. Ordering information C; f = 1kHz; measured in test circuit of Figure 9; unless otherwise specied. 5. Block diagram TDA8566 (1) Pin HEATTAB is available in TDA8566TH1 only. Fig 1. Block diagram 240 W/2 stereo BTL car radio power amplier 6. Pinning information TDA8566Q TDA8566TH1 TDA8566TH Fig 4. Pin conguration TDA8566Q NXP Semiconductors TDA8566 6.2 Pin description 7. Functional description 7.3 Short-circuit diagnostic (pin DIAG) 7.4 Temperature pre-warning (pin DIAG) 7.5 Open-collector diagnostic outputs NXP Semiconductors TDA8566 7.6 Differential inputs 8. Limiting values 9. Thermal characteristics In accordance with the Absolute Maximum Rating System (IEC 60134). Thermal characteristics in accordance with IEC 60747-1. 10. Static characteristics C; measured in test circuit of Figure9; unless otherwise specied. 11. Dynamic characteristics =2 C; R ; f = 1kHz; measured in test circuit of Figure 9; unless otherwise specied. 12. Application information Table 8. Dynamic characteristics Fig 8. Mode select switch circuit i =2 13. Test information Fig 9. Stereo BTL test diagram TDA8566 14. Package outline Fig 10. Package outline SOT418-3 (HSOP20) HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 Fig 11. Package outline SOT566-3 (HSOP24) HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3 Fig 12. Package outline SOT243-1 (DBS17P) Product data sheet Rev. 06 15 October 2007 15 of 21 DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 15. Soldering 15.4 Reow soldering For further information on temperature proles, refer to Application Note AN10365 Surface mount reow soldering description . MSL: Moisture Sensitivity Level Fig 13. Temperature proles for large and small components 16. Revision history Product data sheet Rev. 06 15 October 2007 20 of 21 17. Legal information 17.1 Data sheet status 17.2 Denitions 17.3 Disclaimers 17.4 Trademarks 19. Contents