Philips TDA8571J Data Handbook IC26; Integrated Circuit Packages

2002 Mar 05 16

Philips Semiconductors Product speciﬁcation

4×40 W BTL quad car radio power

ampliﬁer TDA8571J

SOLDERING

Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual

soldering.A more in-depth account of soldering ICs can be

found in our

“Data Handbook IC26; Integrated CircuitPackages”

(document order number 9398 65290011).

Wave soldering is the preferred method for mounting of

through-hole mount IC packages on a printed-circuit

board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds.

Thetotal contact time of successive solder waves must not

exceed 5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

maybe necessary immediately after soldering to keep the

temperature within the permissible limit.

Manual soldering

Applythe soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

PACKAGE SOLDERING METHOD

DIPPING WAVE

DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)