Philips TDA8944J 13. Internal circuitry

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 12 of 21

13. Internal circuitry

Table 9: Internal circuitry

Pin Symbol Equivalent circuit

6 and 8 IN1+ and IN1−

12 and 9 IN2+ and IN2−

1 and 4 OUT1−and OUT1+

14 and 17 OUT2−and OUT2+

10 MODE

11 SVR

1.5 kΩ1.5 kΩ

45 kΩ45 kΩ

VCC

MGL946

1 : 1 1 : 1

1/2 VCC

(SVR)

8, 9 6, 12

40 Ω

100 Ω

MGL947

1, 4, 14, 17

1/2 VCC

1 kΩ

10 kΩ

OFF

HIGH MUTE

HIGH

1 kΩ

VCC

MGL949

Standby

20 kΩ

VCC

MGL948

Contents

Main TDA8944J 2 x 7 W stereo Bridge Tied Load (BTL) audio amplier Rev. 02 14 February 2000 Product specication 1. General description 2. Features 5. Ordering information 6. Block diagram 7. Pinning information 7.1 Pinning 7.2 Pin description Philips Semiconductors TDA8944J 8. Functional description 8.1 Input conguration 8.2 Power amplier 8.3 Mode selection 8.4 Supply Voltage Ripple Rejection (SVRR) 8.5 Built-in protection circuits 2 x 7 W stereo BTL audio amplier 9. Limiting values =8 =25 10. Thermal characteristics 11. Static characteristics In accordance with the Absolute Maximum Rating System (IEC 60134). 12. Dynamic characteristics =8 =25 V =12V; T Philips Semiconductors TDA8944J Fig 5. Output voltage as function of mode voltage. frequency. No bandpass lter applied. THD = 10%. VCC =12V. No bandpass lter applied. Fig 12. Channel separation as function of frequency. Fig 13. Supply voltage ripple rejection as function of frequency. 13. Internal circuitry 11 SVR 1 and 4 OUT1and OUT1+ 14 and 17 OUT2and OUT2+ 10 MODE 14. Application information 14.1 Printed-circuit board (PCB) Fig 14. Application diagram. TDA8944J Page 14.2 Thermal behaviour and heatsink calculation 15. Test information General Quality Specication for Integrated Circuits, SNW-FQ-611D 15.1 Quality information 15.2 Test conditions 16. Package outline Fig 16. DBS17P package outline. DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 17. Soldering 17.1 Introduction to soldering through-hole mount packages Data Handbook IC26; Integrated Circuit Packages 17.2 Soldering by dipping or by solder wave 17.3 Manual soldering 18. Revision history 19. Data sheet status 20. Denitions 21. Disclaimers Philips Semiconductors - a worldwide company Internet: http://www.semiconductors.philips.com Contents