Philips Semiconductors TDA8946J
2 x 15 W stereo BTL audio amplifier
Product specification Rev. 02 — 14 March 2000 18 of 23
9397 750 06863 © Philips Electronics N.V. 2000. All rights reserved.
17. Soldering
17.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
17.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 °C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
17.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.
17.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package Soldering method
Dipping Wave
DBS, DIP, HDIP, SDIP, SIL suitable suitable[1]