Philips TDA8946J 7. Pinning information

Philips Semiconductors TDA8946J

2 x 15 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 March 2000 3 of 23

7. Pinning information

7.1 Pinning

7.2 Pin description

Fig 2. Pin conﬁguration.

handbook, halfpage

TDA8946J

MBK932

OUT1−

GND1

VCC1

OUT1+

n.c.

IN1+

n.c.

IN1−

IN2−

MODE

SVR

IN2+

n.c.

OUT2−

GND2

VCC2

OUT2+

Table 3: Pin description

Symbol Pin Description

OUT1−1 negative loudspeaker terminal 1

GND1 2 ground channel 1

VCC1 3 supply voltage channel 1

OUT1+4 positive loudspeaker terminal 1

n.c. 5 not connected

IN1+6 positive input 1

n.c. 7 not connected

IN1−8 negative input 1

IN2−9 negative input 2

MODE 10 mode selection input (standby, mute, operating)

SVR 11 half supply voltage decoupling (ripple rejection)

IN2+12 positive input 2

Contents

Main TDA8946J 2 x 15 W stereo Bridge Tied Load (BTL) audio amplier Rev. 02 14 March 2000 Product specication 1. General description 2. Features 5. Ordering information 6. Block diagram 7. Pinning information 7.1 Pinning 7.2 Pin description Philips Semiconductors TDA8946J 8. Functional description 8.1 Input conguration 8.2 Power amplier 8.3 Mode selection Philips Semiconductors TDA8946J 8.4 Supply Voltage Ripple Rejection (SVRR) 8.5 Built-in protection circuits 9. Limiting values 10. Thermal characteristics 11. Static characteristics =8 =25 In accordance with the Absolute Maximum Rating System (IEC 60134). 12. Dynamic characteristics =8 =25 V =18V; T Philips Semiconductors TDA8946J Fig 5. Output voltage as function of mode voltage. Fig 6. Total harmonic distortion as function of output power. No bandpass lter applied. Fig 7. Total harmonic distortion as function of frequency. THD = 10%. VCC =18V. V No bandpass lter applied. Fig 12. Channel separation as function of frequency. Fig 13. Supply voltage ripple rejection as function of frequency. 13. Internal circuitry 11 SVR 1 and 4 OUT1- and OUT1+ 14 and 17 OUT2and OUT2+ 10 MODE Product specication Rev. 02 14 March 2000 14 of 23 14. Application information 14.1 Printed-circuit board (PCB) Fig 14. Application diagram. TDA8946J Page 14.2 Thermal behaviour and heatsink calculation 15. Test information General Quality Specication for Integrated Circuits, SNW-FQ-611D 15.1 Quality information 15.2 Test conditions 16. Package outline Fig 16. DBS17P package outline. DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 17. Soldering 17.1 Introduction to soldering through-hole mount packages Data Handbook IC26; Integrated Circuit Packages 17.2 Soldering by dipping or by solder wave 17.3 Manual soldering 18. Revision history Page 19. Data sheet status 20. Denitions 21. Disclaimers Philips Semiconductors - a worldwide company Internet: http://www.semiconductors.philips.com Contents