TZA3046_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 19 May 2006 3 of 15
Philips Semiconductors TZA3046
Fiber Channel/Gigabit Ethernet transimpedance amplifier
6. Pinning information
6.1 Pinning
6.2 Pin description
Fig 2. Pin configuration
001aae512
VCC
IDREF_MON
AGC
OUTQ
OUT
GND
GND
VCC
IDREF_MON
AGC
DREF
IPHOTO
DREF
OUT
OUTQ
GND
GND
31
174
165
156
129
1110
2
7
8
14
13
TZA3046
Table 2: Bonding pad description
Bonding pad locations with respect to the center of the die (see Figure 10); X and Y are in
µ
m.
Symbol Pad X Y Type Description
DREF 1 −493.6 140 output bias voltage output for PIN diode; connect cathode of PIN diode to
pad 1 or pad 3
IPHOTO 2 −493.6 0 input current input; anode of PIN diode should be connected to this pad
DREF 3 −493.6 −140 output bias voltage output for PIN diode; connect cathode of PIN diode to
pad 1 or pad 3
VCC 4−353.6 −278.6 supply supply voltage; connect supply voltage to pad 4 or pad 17
IDREF_MON 5 −213.6 −278.6 output current output for RSSI measurements; connect a resistor to pad 5
or pad 16 and ground
AGC 6 −73.6 −278.6 input AGC voltage; use pad 6 or pad 15
OUTQ 7 66.4 −278.6 output data output; complement of pad OUT; use pad 7 or pad 13
OUT 8 206.4 −278.6 output data output; use pad 8 or pad 14 [1]
GND 9 346.4 −278.6 ground ground; connect together pads 9, 10, 11 and pad 12 as many as
possible
GND 10 486.4 −278.6 ground ground; connect together pads 9, 10, 11 and pad 12 as many as
possible