the solder (see the associated diagrams).
Another commonly used technique is to glue the surface mount components to the printed circuit board before soldering. The procedure is to take a small amount of glue (usually with a pin or toothpick) and “dab” the circuit board in the place where the component will be affixed. Be careful not to apply too much glue as when the part is placed it may “squash” the glue underneath the soldering tabs of the component. Carefully place the part into position,
and when the glue dries, solder the connection.
This may go a little “against the grain” at first, but it is by far the easiest method. Notice also that when reheating the solder that the iron tip does not come in contact with the “tab” on the body of the chip component. Over heat- ing of this solder tab can cause a fracture of the bond to the component, causing an intermittent connection.
MR6 • 6
