Rockford Fosgate 400x4 operation manual XCard Internal Crossover

◆DSM (Discrete Surface Mount) Technology

The DSM (Discrete Surface Mount) manufacturing process com- bines the advantages of both discrete components and integrated circuitry. Rockford Fosgate is the only American amplifier manu- facturer to have invested millions into this process. DSM compo- nents differ from conventional discrete components in three ways. They are more compact, more rugged, and they efficiently dissipate generated heat. Using them wherever appropriate al- lows the advantages associated with discrete circuitry to be retained while also providing room for both highly advanced processing features and generous PC board copper paths where needed. Their short lead-out structures allow maximum audio performance and highest signal-to-noise ratios to be obtained in amplifiers of desirable package size without resorting to “ampli- fier-on-a-chip” shortcuts. These advantages are shown in Figure 1.

Figure 1		Component
	Solder	Solder
Thru-Hole	Surface Mount

THE RESULT: Fewer connections, improved reliability, shorter signal paths, superior signal-to-noise ratio and awesome sonic performance.

◆XCard (Internal Crossover)

The Punch and Power amplifiers utilize internal active cross- overs. These crossovers have many performance advantages such as using discrete components for exact frequency adjustments which are far superior to potentiometers. Additionally, the XCard can be configured for high-pass, low-pass and full range opera- tion. With slight modifications, many crossover frequencies and slope configurations can be achieved.

THE RESULT: Increased system design flexibility with a precise electronic crossover without the limitations of conventional potentiometer designs.

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