test dishes

According to standard EN 60350 and DIN44547

1. Grilling

Use this function with the maximum temperature setting of High. Preheat the empty oven for 5 minutes.

Type of food

Dish & Notes

Shelf

Cooking

Temp.

Cooking

level

mode

(°C)

time (min.)

 

 

 

 

 

 

 

 

White bread

Big grid

5

Large Grill

High

1st: 1-2

toast

 

 

 

 

2nd: 1-1 1/2

 

 

 

 

 

 

 

 

 

 

 

Beef burgers*

Small grid + Baking

4

Large Grill

High

1st: 14-16

(12ea)

tray (to catch

3

 

 

2nd: 3-5

 

drippings)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

*Beef Burgers: Preheat the empty oven for 15 minutes using Large Grill function. 2. Baking

The recommendations for baking refer to preheated oven.

Insert baking tray with bevelled side towards the back side of oven.

Type of food

Dish & Notes

Shelf

Cooking

Temp.

Cooking

level

mode

(°C)

time (min.)

 

 

 

 

 

 

 

 

Shortbread

Baking tray

3

Conventional

160-170

20-30

 

 

 

 

 

 

 

 

2

Convection

150-160

30-35

 

 

 

 

 

 

 

2 Baking tray

1+4

Convection

150-160

35-40

 

 

 

 

 

 

Small cake

Baking tray

3

Conventional

160-180

15-25

 

 

 

 

 

 

 

 

2

Convection

150-160

30-35

 

 

 

 

 

 

 

2 Baking tray

1 + 4

Convection

150-160

35-40

 

 

 

 

 

 

Fatless

Springform cake tin on

2

Conventional

160-180

20-30

sponge cake

Big grid

 

 

 

 

2

Convection

150-160

30-40

 

(Dark coated, ø 26 cm)

 

 

 

 

 

 

 

 

 

 

 

Apple Yeast

Baking tray

3

Conventional

170-180

35-40

Tray Cake

 

 

 

 

 

 

 

2

Convection

150-160

60-70

 

 

 

 

 

 

 

2 Baking tray

1+4

Convection

150-160

70-80

 

 

 

 

 

 

Apple pie

Big grid + 2 Springform

1

Conventional

170-190

70-90

 

cake tins *

Placed

 

 

 

 

(Dark coated, ø 20 cm)

diagonally

 

 

 

 

 

 

 

 

 

 

Baking tray + Big grid +

1+3

Convection

170-190

80-100

 

2 Springform cake

 

 

 

 

 

tins **

 

 

 

 

 

(Dark coated, ø 20 cm)

 

 

 

 

 

 

 

 

 

 

*Two cakes are arranged on the grid at the back left and at the front right.

**Two cakes are arranged in the center on top of each other.

10_test dishes

BF1 Series_XEE-00352C_EN.indd 10

2011-06-27 ￿￿ 8:22:24

Page 66
Image 66
Samsung BF1C6G133/XEE manual Test dishes, Type of food Dish & Notes Shelf Cooking Temp

BF1C6G133/XEE specifications

The Samsung BF1C6G133/XEE is a highly regarded component within the realm of memory modules, specifically designed to cater to a variety of computing needs. This DDR3 SDRAM (Synchronous Dynamic Random Access Memory) module is known for its balanced performance and efficiency, making it a suitable choice for various applications ranging from personal computing to servers.

One of the standout features of the BF1C6G133/XEE is its capacity. Typically offered in a 4GB configuration, it provides ample memory for multitasking, allowing users to run multiple applications simultaneously without significant performance degradation. This is particularly beneficial for users who frequently switch between programs or engage in memory-intensive tasks.

The operating speed of the BF1C6G133/XEE is another key attribute. With a standard clock speed of 1333 MHz, it delivers reliable performance that meets the needs of most modern applications. This speed ensures that data can be processed swiftly, contributing to an overall enhanced user experience. Moreover, the module adheres to the JEDEC standards, ensuring compatibility with a wide range of devices and systems.

Energy efficiency is a focus in the design of the BF1C6G133/XEE, operating at a voltage of 1.5V. This lower voltage consumption not only helps in reducing power costs but also plays a role in prolonging the lifespan of the memory module. Additionally, the idea of heat dissipation is addressed through its construction, helping to maintain optimal operating temperatures even under heavy workloads.

The memory module also incorporates advanced features such as ECC (Error-Correcting Code), which provides an added layer of reliability. ECC detects and corrects internal memory corruption, making the BF1C6G133/XEE a favored choice for mission-critical applications where data integrity is paramount.

In terms of physical characteristics, the module is designed in a standard DIMM form factor, ensuring easy installation and compatibility with a wide range of motherboards. Its compact design allows for better airflow within a PC case, further enhancing performance.

Overall, the Samsung BF1C6G133/XEE stands out as a robust and efficient memory solution that combines speed, reliability, and energy efficiency, making it an ideal choice for a host of computing environments. Whether in a gaming rig, a workstation, or a server, this module is equipped to handle the demands of today’s technology-rich landscape.