TCO'03 Recycling Information (TCO'03 applied model only)

For recycling information for TCO'03 certified monitors, for the residents in the following countries, please contact the company corresponding to your region of residence. For those who reside in other countries, please contact a nearest local Samsung dealer for recycling information for the products to be treated in environmentally acceptable way.

[U.S.A. Residents Only]

[European Residents Only]

 

U.S.A.

COMPANY

Solid Waste Transfer &

Recycling Inc

 

ADDRESS

442 Frelinghuysen Ave Newark,

NJ 07114

 

TELEPHONE 973-565-0181

FAX 973-565-9485

E-MAIL none

http://www.bcua.org/ HOME PAGE SolidWaste_Disposal.htm

SWEDEN

ELKRETSEN

ELKRETSEN Box 1357, 111 83 Stockholm Barnhusgatan 3, 4 tr.

08-545 212 90

08-545 212 99

info@el-kretsen.se

http://www.el- kretsen.se/

NORWAY

Elektronikkretur AS

6454 Etterstad 0602 Oslo Fyrstikkalln 3B

23 06 07 40

23 06 07 41

adm@elektronikkretur.no

http://www.elretur.no/

GERMANY

vfw AG

Max Plank Strasse 42

50858 Collogne Germany

49 0 2234 9587 -

0

vfw.info@vfw- ag.de

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Samsung DS17BSDS/EDC, DS15ASDS/EDC manual TCO03 Recycling Information TCO03 applied model only

DS17BSDS/EDC, DS15ASDS/EDC specifications

Samsung has solidified its position as a leader in the semiconductor industry with its innovative approach to manufacturing and design. Among the cutting-edge offerings are the Samsung DS15ASDS/EDC and DS17BSDS/EDC semiconductor products, which are at the forefront of advanced material technology and design efficiency.

The Samsung DS15ASDS/EDC is tailored for robust applications, combining high speed and energy efficiency. It is engineered using the latest 7nm process technology, which enhances its performance while minimizing power consumption. This makes it an ideal choice for high-performance computing, AI applications, and data center solutions. The chip features advanced thermal management systems, ensuring reliability even in demanding environments. Additionally, its integrated power management unit ensures optimal power distribution, which is critical for maximizing performance and minimizing waste.

On the other hand, the DS17BSDS/EDC focuses on versatility and scalability, catering to a broader range of applications, from mobile devices to embedded systems. It is designed with a modular architecture that allows for easy integration and customization, providing manufacturers with the flexibility to tailor the chip's capabilities. The DS17BSDS/EDC boasts enhanced security features, including hardware-level encryption and secure boot capabilities, addressing the growing concerns around data privacy and infrastructure integrity.

Both models incorporate Samsung's proprietary technologies, such as Dynamic Voltage Frequency Scaling (DVFS) and Adaptive Thermal Control, which work in tandem to dynamically adjust performance and power usage based on real-time workloads. This adaptability is crucial in optimizing performance while maintaining energy efficiency.

With integrated graphics support and advanced connectivity options, including high-speed interfaces, these devices are well-equipped to meet the current demands for high-definition content and fast data transfer rates. The advancements in electromagnetic compatibility (EMC) further ensure that these products perform reliably in various environments while maintaining compliance with international standards.

Samsung's commitment to innovation and quality in the design of the DS15ASDS/EDC and DS17BSDS/EDC embodies their dedication to advancing technology and meeting the ever-evolving demands of the semiconductor landscape. These devices pave the way for future advancements in multiple sectors, ensuring that Samsung remains at the forefront of the industry.