Technical Specifications
18
SAMSUNG continually strives to improve its products. Both the design specifications and these
user instructions are thus subject to change without notice.
DISC
GENERAL
RELIABILITY
DRIVE
PERFORMANCE
FRONT PANEL
REAR PANEL
OPERATING
ENVIRONMENT
Erasing disc types
Disc diameter
Disc types supported
in read mode
Data transfer rate
Access time (typical)
Recording
Reading
PIO Mode 4:16.6MB/sec
Multiword DMA mode 2:16.6MB/sec
Ultra DMA mode 2:33.3MB/sec
CD-R
600KB/sec ( 4X), 1200KB/sec ( 8X)
1800KB/sec (12X), 2400KB/sec (16X)
CD-RW
300KB/sec ( 2X), 600KB/sec ( 4X)
1500KB/sec (10X)
CD/CD-R
DVD
CAV 40 Access Time
CAV 12 Access Time
110ms (typical) 130ms/110ms (typical)
Data Buffer 8MB
Laser Semiconductor laser
Slide mechanism Stepping motor
Spindle motor Brushless motor
Load mechanism
ERROR RATE
Eject button
Indicator
Headphone output
Volume control
Required power
Interface connector
Audio output
Jumper block
Tray. DC motor (Soft Eject). Horizontal/Vertical.
Mode 1: 1 block/1012, Mode 2: 1 block/109
Auto eject or Auto inject
If the Power is ON/BUSY, this means the disc is loaded.
Green: Reading/Recording Status
Stereo mini-jack (Ø 3.6 mm) 0.6±20% (vrms) 33Ω
Dial type
+5 VDC: 2.0A (max.), +12 VDC: 1.5 A (max.)
ATAPI (E-IDE)
Line out 0.75±20% (vrms) : 47KΩ
Molex 70203 or other compatible models
Operations
Temperature: 0~50°C Humidity: 10~80%
Storage
Temperature: -25~55°C Humidity: 10~90%
Dimensions
Net weight
MTBF
DVD-ROM, DVD-VIDEO, DVD-R, DVD - RW, CD-DA (Audio),
CD-ROM, CD-ROM XA, CD-Plus, CD-Extra, Photo-CD
(Single, Multi-session), Video CD ready, Enhanced CD,
CD-I/FMV, CD-R, CD-RW, CD-TEXT
CD-RW
120 mm or 80 mm
148.2 (W) x 42 (H) x 184 (D) mm (including bezel)
770 g
125,000 POH(Duty 20%)