Electrical Parts List

Level Loc. No. Code No.

Description ; Specification

Remark

 

 

 

Level Loc. No. Code No. Description ; Specification

Remark

 

 

2

FA803S

3601-001228

FUSE-AXIAL LEAD;125V,10A,FAST-ACTING,EPO

3

IC1

1204-001789

IC-VIDEO PROCESS;VPC3230D-B3,QFP,80P,787

2

R407

2001-001114

R-CARBON(S);270OHM,5%,1/2W,AA,TP,2.4X6.4

3

IC2

1204-001858

IC-PICTURE PROCESS;SDA9401,QFP,64P,-,PLA

2

C828

2201-000376

C-CERAMIC,DISC;0.22nF,5%,50V,SL,TP,6.3x3

3

JP1

2007-000070

R-CHIP;0ohm,5%,1/16W,DA,TP,1608

2

R405

2008-001013

R-FUSIBLE(S);1.2ohm,5%,2W,AF,TP,3.9x10mm

3

R17

2007-000070

R-CHIP;0ohm,5%,1/16W,DA,TP,1608

2

R704

2001-000969

R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM

3

R19

2007-000070

R-CHIP;0ohm,5%,1/16W,DA,TP,1608

2

R242

2001-000969

R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM

3

R7

2007-000070

R-CHIP;0ohm,5%,1/16W,DA,TP,1608

2

J919

2701-000183

INDUCTOR-AXIAL;39uH,5%,2.5x3.4mm

3

L1

2007-000070

R-CHIP;0ohm,5%,1/16W,DA,TP,1608

2

D408

0402-000493

DIODE-RECTIFIER;1R5GU41,400V,1.5A,DO-15L

3

R10

2007-000084

R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608

2

R826

2003-001035

R-METAL OXIDE(S);27ohm,5%,2W,AF,TP,3.9x1

3

R1

2007-000090

R-CHIP;10KOHM,5%,1/16W,DA,TP,1608

2

KEZI

2303-000296

C-FILM,PPF;18nF,0.05,630V,BK,20x16x9.5mm

3

R2

2007-000090

R-CHIP;10KOHM,5%,1/16W,DA,TP,1608

2

C410

2301-000213

C-FILM,PEF;220nF,5%,250V,TP,21.5x11,7.5

3

R3

2007-000090

R-CHIP;10KOHM,5%,1/16W,DA,TP,1608

2

C427

2401-002267

C-AL;2.2uF,20%,250V,GP,TP,8x11.5,5

3

R4

2007-000090

R-CHIP;10KOHM,5%,1/16W,DA,TP,1608

2

D413

0402-000537

DIODE-RECTIFIER;RH1A,600V,0.6A,DO-204AC

3

R5

2007-000090

R-CHIP;10KOHM,5%,1/16W,DA,TP,1608

2

R436

2003-002008

R-METAL OXIDE(S);18Kohm,5%,2W,AF,TP,3.9x

3

R13

2007-001166

R-CHIP;75OHM,5%,1/10W,DA,TP,2012

2

C203

2401-000480

C-AL;10uF,20%,50V,GP,TP,5x11,5

3

R14

2007-001166

R-CHIP;75OHM,5%,1/10W,DA,TP,2012

2

R944

2001-000613

R-CARBON;3.9KOHM,5%,1/8W,AA,TP,1.8X3.2M

3

R15

2007-001166

R-CHIP;75OHM,5%,1/10W,DA,TP,2012

2

L910

2701-000215

INDUCTOR-AXIAL;8.2uH,10%,2.5x3.4mm

3

R6

2007-001167

R-CHIP;75ohm,5%,1/16W,DA,TP,1608

2

C926

2202-000154

C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP

3

R9

2007-001167

R-CHIP;75ohm,5%,1/16W,DA,TP,1608

2

L222

2701-000184

INDUCTOR-AXIAL;4.7uH,10%,2.5x3.4mm

3

CD3

2203-000041

C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP,

2

R835

2003-002181

R-METAL OXIDE(S);68Kohm,5%,2W,AG,TP,3.9x

3

CD4

2203-000041

C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP,

2

R836

2003-002181

R-METAL OXIDE(S);68Kohm,5%,2W,AG,TP,3.9x

3

C21

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

L208

2701-000147

INDUCTOR-AXIAL;2.2uH,5%,2.4x3.4mm

3

C39

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

C246

2202-000210

C-CERAMIC,MLC-AXIAL;270pF,10%,50V,Y5P,TP

3

C42

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

C248

2202-000210

C-CERAMIC,MLC-AXIAL;270pF,10%,50V,Y5P,TP

3

C43

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

C247

2202-000849

C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.

3

C44

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

F801A

3602-000114

FUSE-HOLDER;-,-,30mohm

3

C51

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

F801B

3602-000114

FUSE-HOLDER;-,-,30mohm

3

C52

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

! 2

FP801S

3601-000297

FUSE-CARTRIDGE;250V,5A,TIME-LAG,GLASS,5.

3

C53

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

RX801S

2002-001010

R-COMPOSITION;1.8Mohm,5%,1/2W,AA,TP,3.7x

3

C54

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

R315

2004-002022

R-METAL(S);51Kohm,1%,1/2W,AA,TP,2.4x6.4m

3

C55

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

IC901

AA09-00221A

IC MICOM;SIM806HEW2-A042,SIM806HEW2-A042

3

C56

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

IC601

1204-001661

IC-SOUND PROCESSOR;MSP3411G-A2,DIP,52P,-

3

C57

2203-000181

C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,

2

T401

AA26-50001S

TRANS-HORIZ.DRIVE;-,-,-,6.0mH,-,-,44uH,-

3

C27

2203-000236

C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608

2

TU01S

AA40-00079A

TUNER;TCPW3001PD16A(S),PAL,181CH,38.

3

C33

2203-000236

C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608

2

 

AA98-00245A

ASSY SUB PART;S51A,PCB MAIN(OPT)

3

C37

2203-000236

C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608

3

 

0202-001222

SOLDER-WIRE FLUX;RS-107,RS60-1.2AA,D1.2,

3

C16

2203-000257

C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608

3

 

0202-000187

SOLDER-WIRE FLUX;-,RS60S,D1.2,63Sn/37Pb

3

C1

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

3

 

0202-001046

SOLDER-WIRE FLUX;CF-110VH-2A,-,-,-,-

3

C13

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

3

 

0204-000442

SOLVENT;1M-1000,C3H70H,96,-

3

C17

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

2

T801S

AA26-00046B

TRANS SWITCHING;CODE-NO,CW6844N8X/XEF,-,

3

C18

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

2

IC804

HA96-00243C

ASSY-H/S;-,REGULATOR,AA62-00045A,KA7806

3

C2

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

3

 

1203-000284

IC-POSI.FIXED REG.;7806,TO-220,3P,-,PLAS

3

C24

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

3

 

6003-000333

SCREW-TAPTITE;RH,+,2S,M3,L10,ZPC(YEL),SW

3

C25

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

3

 

AA62-00065A

HEAT SINK-PS;DP,-,-,-,AA62-00045A,-,-,-,

3

C26

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

3

 

0205-000129

GREASE-SILICON;SC102,JAPAN

3

C5

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

2

L408

AA27-40003P

COIL HORIZ. WIDTH;-,120uH/180uH,Th8x20,U

3

C7

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

2

LX801S

AA29-00015A

FILTER LINE NOISE;WS32W8,28-20MH 1.5A,+-

3

C8

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

2

L405

AA27-00057A

COIL HORIZ. WIDTH;-,10mH,YL-9N 15x27.5 C

3

C9

2203-000491

C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608

2

IC803

1203-001697

IC-VOLTAGE REGULATOR;78R08,TO-220,4P,-,P

3

C20

2203-000552

C-CERAMIC,CHIP;0.02nF,5%,50V,NP0,TP,1608

2

Q404

HA96-00437A

ASSY-H/S;ASSY-H/S;AA62-00076A,IRF620

3

C6

2203-000659

C-CERAMIC,CHIP;0.27nF,5%,50V,NP0,TP,1608

3

 

0505-000156

FET-SILICON;IRF620,N,200V,5A,0.8ohm,50W,

3

C23

2203-000975

C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608,

3

 

6003-000333

SCREW-TAPTITE;RH,+,2S,M3,L10,ZPC(YEL),SW

3

C3

2203-000975

C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608,

3

 

HA62-00076A

HEAT SINK;AL,100Hz,T1.0,10,40

3

C11

2203-001052

C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160

2

Q402

0505-001116

FET-SILICON;BUZ73A,N,200V,22A,0.6ohm,40W

3

C14

2203-001052

C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160

2

CY802S

2201-002002

C-CERAMIC,DISC;4.7nF,20%,400V,Y5U,TP,16x

3

C19

2203-001052

C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160

2

C407

2301-001338

C-FILM,MPE-PPF;0.68nF,5%,1.6kV,TP,28x7x1

3

C4

2203-001052

C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160

2

C405

2303-001015

C-FILM,PPF;5.5nF,5%,1.6kV,TP,29x9.5x17,2

3

C22

2203-001256

C-CERAMIC,CHIP;0.008nF,0.25pF,50V,NP0,TP

2

C406

2303-001015

C-FILM,PPF;5.5nF,5%,1.6kV,TP,29x9.5x17,2

3

C38

2203-001603

C-CERAMIC,CHIP;220nF,10%,16V,X7R,TP,2012

2

C426

2306-000204

C-FILM,MPPF;430nF,5%,400V,TP,26x20.5x12.

3

C28

2203-002494

C-CERAMIC,CHIP;470nF,10%,16V,X7R,TP,2012

2

IC903

1203-001944

IC-POSI.FIXED REG.;78RM33,TO-220,3P,-,PL

3

C32

2203-002494

C-CERAMIC,CHIP;470nF,10%,16V,X7R,TP,2012

2

IC202

1203-001944

IC-POSI.FIXED REG.;78RM33,TO-220,3P,-,PL

3

C34

2203-002494

C-CERAMIC,CHIP;470nF,10%,16V,X7R,TP,2012

2

C806

2401-003031

C-AL;470uF,20%,450V,GP,BK,35x45mm,1

3

C36

2203-002494

C-CERAMIC,CHIP;470nF,10%,16V,X7R,TP,2012

2

C820

2401-003076

C-AL;3300uF,20%,50V,WP,BK,18x35.5mm

3

CE1

2401-000480

C-AL;10uF,20%,50V,GP,TP,5x11,5

2

R807

2006-001083

R-CEMENT;120ohm,5%,5W,CJ,TP,14x10x27mm

3

CE2

2401-000480

C-AL;10uF,20%,50V,GP,TP,5x11,5

2

C423

2301-001192

C-FILM,MPPF;820nF,5%,400V,TP,29x18.5x25.

3

CE4

2401-000480

C-AL;10uF,20%,50V,GP,TP,5x11,5

2

TOP

AA39-20010B

LEAD CONNECTOR-ASSY;,1P,YFH800-01,S,500,

3

CE5

2401-000480

C-AL;10uF,20%,50V,GP,TP,5x11,5

2

L808

AA27-10002L

COIL CHOKE;-,24uH,K,-,2A,-,24UH-K,10x10m

3

CE3

2401-001026

C-AL;3.3UF,20%,50V,GP,TP,5X11,5

2

L402

AA27-10004F

COIL CHOKE;-,56uH,K,-,2.5A,BK,-,DR12x15,

3

L2

2702-001092

INDUCTOR-RADIAL;2.2uH,10%,6x4mm

2

T444S

AA26-00132A

TRANS FBT;1372.0074A,CT29A6,1.8MH,135V

3

X2

2801-003432

CRYSTAL-UNIT;20.25MHZ,30PPM,28-AAM,13PF,

2

L403

AA27-00015A

COIL LINEARITY;-,7.3UH,L81 DR15X18,-,-,B

3

L3

3301-001324

CORE-FERRITE BEAD;AB,15OHM,2X1.25X0.9MM,

2

IC201S

HA98-00134B

ASSY-SIPADOSS MODULE;DP,KS3A,100HZ,SDA94

3

L4

3301-001324

CORE-FERRITE BEAD;AB,15OHM,2X1.25X0.9MM,

3

 

AA95-00989A

ASSY ETC-CHROMA BODY;DP,-,KS3A,-,-,100HZ

3

CN64

3711-004778

CONNECTOR-HEADER;NOWALL,64P,2R,2MM,ANGLE

4

P1

3711-004782

CONNECTOR-HEADER;NOWALL,32P,1R,1.778MM,S

3

PCB

AA41-00475A

PCB-SIPADOS TOP;CS29A5,FR-4,4L,A,1.6T,18

4

P2

3711-004782

CONNECTOR-HEADER;NOWALL,32P,1R,1.778MM,S

2

CN801

3711-004721

CONNECTOR-HEADER;3WALL,2P,1R,12.5mm,STRA

4

PCB

AA41-00411A

PCB-SIPADOS BODY;CS29A5,FR-4,2L,A,1.6T,1

2

CN802

3711-004720

CONNECTOR-HEADER;3WALL,2P,1R,12.5mm,STRA

3

IC3

1204-001909

IC-VIDEO PROCESS;DDP3310B-F6,PLCC,68P,-,

2

CN701A

AA39-00306A

LEAD CONNECTOR-ASSY;KS3A,UL2547#26,UL/CS

7-16

Samsung Electronics

Page 64
Image 64
Samsung WS28V55VS8XXEC IC1, IC2, JP1, Kezi, CD3, CD4, Assy SUB PARTS51A,PCB Mainopt, SOLDER-WIRE FLUXCF-110VH-2A, CE1, CE2