FEAST Fast Ethernet Controller with Full Duplex Capability
Package Outlines
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| Figure 2 208 Pin QFP Package Outline | |||
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| Table 1 208 Pin QFP Package Parameters | |||
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| MIN |
| NOMINAL |
| MAX | REMARK |
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A | ~ |
| ~ |
| 4.07 | Overall Package Height |
A1 | 0.05 |
| ~ |
| 0.5 | Standoff |
A2 | 3.17 |
| ~ |
| 3.67 | Body Thickness |
D | 30.35 |
| ~ |
| 30.85 | X Span |
D1 | 27.90 |
| ~ |
| 28.10 | X Body Size |
E | 30.35 |
| ~ |
| 30.85 | Y Span |
E1 | 27.90 |
| ~ |
| 28.10 | Y body Size |
H | 0.09 |
| ~ |
| 0.20 | Lead Frame Thickness |
L | 0.45 |
| 0.60 |
| 0.75 | Lead Foot Length |
L1 | ~ |
| 1.30 |
| ~ | Lead Length |
e | 0o |
| 0.50 Basic |
| 7o | Lead Pitch |
q |
| ~ |
| Lead Foot Angle | ||
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W | 0.10 |
| ~ |
| 0.30 | Lead Width |
R1 | 0.08 |
| ~ |
| ~ | Lead Shoulder Radius |
R2 | 0.08 |
| ~ |
| 0.25 | Lead Foot Radius |
ccc | ~ |
| ~ |
| 0.08 | Coplanarity |
Notes:
1.Controlling Unit: millimeter.
2.Tolerance on the true position of the leads is ± 0.04 mm maximum.
3.Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.
4.Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5.Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC LAN91C100FD REV D | PRODUCT5 PREVIEW | Revision 1.0 |