FEAST Fast Ethernet Controller with Full Duplex Capability

 

 

 

Figure 3 208 Pin TQFP Package Outline

 

 

 

Table 2 208 Pin TQFP Package Parameters

 

 

 

 

 

 

 

 

MIN

 

NOMINAL

 

MAX

REMARK

 

 

 

 

 

 

 

A

~

 

~

 

1.60

Overall Package Height

A1

0.05

 

~

 

0.15

Standoff

A2

1.35

 

~

 

1.45

Body Thickness

D

29.80

 

~

 

30.20

X Span

D1

27.90

 

~

 

28.10

X Body Size

E

29.80

 

~

 

30.20

Y Span

E1

27.90

 

~

 

28.10

Y body Size

H

0.09

 

~

 

0.23

Lead Frame Thickness

L

0.45

 

0.60

 

0.75

Lead Foot Length

L1

~

 

1.00

 

~

Lead Length

e

0o

 

0.50 Basic

 

7o

Lead Pitch

q

 

~

 

Lead Foot Angle

 

 

W

0.17

 

0.22

 

0.27

Lead Width

R1

0.08

 

~

 

~

Lead Shoulder Radius

R2

0.08

 

~

 

0.20

Lead Foot Radius

ccc

~

 

~

 

0.08

Coplanarity

Notes:

1.Controlling Unit: millimeter.

2.Tolerance on the true position of the leads is ± 0.04 mm maximum.

3.Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.

4.Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5.Details of pin 1 identifier are optional but must be located within the zone indicated.

Revision 1.0 (09-22-08)

PRODUCT6 PREVIEW

SMSC LAN91C100FD REV D