Super I/O with Temperature Sensing, Quiet Auto Fan and Glue Logic with PECI
Chapter 2 Package Outline
Figure 3 128 Pin QFP Package Outline, 14X20X2.7 Body, 3.2 mm Footprint
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| Table 1 128 Pin QFP Package Parameters | |||
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| MIN |
| NOMINAL |
| MAX | REMARKS |
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A | ~ |
| ~ |
| 3.4 | Overall Package Height |
A1 | 0.05 |
| ~ |
| 0.5 | Standoff |
A2 | 2.55 |
| ~ |
| 3.05 | Body Thickness |
D | 23.00 |
| 23.20 |
| 23.40 | X Span |
D1 | 19.90 |
| 20.00 |
| 20.10 | X body Size |
E | 17.00 |
| 17.20 |
| 17.40 | Y Span |
E1 | 13.90 |
| 14.00 |
| 14.10 | Y body Size |
H | 0.09 |
| ~ |
| 0.20 | Lead Frame Thickness |
L | 0.73 |
| 0.88 |
| 1.03 | Lead Foot Length |
L1 | ~ |
| 1.60 |
| ~ | Lead Length |
e | 0o |
| 0.50 Basic |
| 7o | Lead Pitch |
q |
| ~ |
| Lead Foot Angle | ||
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W | 0.10 |
| ~ |
| 0.30 | Lead Width |
R1 | 0.08 |
| ~ |
| ~ | Lead Shoulder Radius |
R2 | 0.08 |
| ~ |
| 0.30 | Lead Foot Radius |
ccc | ~ |
| ~ |
| 0.08 | Coplanarity |
Notes:
1.Controlling Unit: millimeter.
2.Controlling Unit: millimeter.
3.Tolerance on the position of the leads is ± 0.04 mm maximum.
4.Package body dimensions D1 and E1 do not include the mold protrusion.
5.Maximum mold protrusion is 0.25 mm.
6.Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
7.Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC SCH5027E | PRODUCT5 PREVIEW | Revision 0.2 |