Integrated USB 2.0 Compatible 7-Port Hub

Datasheet

Chapter 9 Package Outline

Figure 9.1 80 Pin TQFP Package Outline (12x12x1.4 mm body - 2 mm footprint)

Table 9.1 80 Pin TQFP Package Parameters

 

MIN

 

NOMINAL

 

MAX

REMARKS

 

 

 

 

 

 

 

A

1.40

 

~

 

1.60

Overall Package Height

A1

0.05

 

~

 

0.15

Standoff

A2

1.35

 

1.40

 

1.45

Body Thickness

D

13.80

 

14.00

 

14.20

X Span

D1

11.80

 

12.00

 

12.20

X body Size

E

13.80

 

14.00

 

14.20

Y Span

E1

11.80

 

12.00

 

12.20

Y body Size

H

0.09

 

~

 

0.20

Lead Frame Thickness

L

0.45

 

0.60

 

0.75

Lead Foot Length

L1

~

 

1.00 REF.

 

~

Lead Length

e

0o

 

0.50 Basic

 

7o

Lead Pitch

q

 

~

 

Lead Foot Angle

 

 

W

0.17

 

0.18

 

0.27

Lead Width

ccc

~

 

~

 

0.08

Coplanarity

Notes:

1.Controlling Unit: millimeter.

2.Tolerance on the true position of the leads is ± 0.04 mm maximum.

3.Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane H.

4.Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5.Details of pin 1 identifier are optional but must be located within the zone indicated.

Revision 2.3 (08-27-07)

44

SMSC USB2507

 

DATASHEET