Sony MZ-E900 Audio Boardside B, IC301, Audio Boardside A, Sw Boardside A, Switch Flexible Board

MZ-E900

Ver 1.1 2001.01

6-6. PRINTED WIRING BOARDS – AUDIO SECTION – : Uses unleaded solder.

A

1 2

AUDIO BOARD (SIDE A)

3

C304

4 5

AUDIO BOARD (SIDE B)

6 7

TAP801

(OPEN/CLOSE)

CN803

1

7

TP826 TP825 C303 C301

C803	R301
C804

	TP305
			R201	R205	R202
	C201
			R101	R105	R102
C204	C101
		C102

19

24

R303		R302
18	13		BCE	Q301
IC301		12
		C306
		7	C305
1	6
C202

R304

	CN802
1		2

B

C

	C104
R816	R103

SW BOARD (SIDE A)

	R106			R206
	C103			C203	C302
R104		R203	R204		TP304	11
				1-679-233-
						(11)

SWITCH FLEXIBLE BOARD1-679-235- 11

5	10
15
19	20	11
	1-679-233- (11)
A MAIN BOARD
	CN801

D

R813

S807

AVLS

NORMtLIMIT

SW BOARD (SIDE B)

R814

S808

HOLDc

OFFtON

R812

S809

(OPEN/CLOSE)

CN804

7 1

1-679-234-

D801

OPR

R811

1-679-234-

11

(11)

11

(11)

zSemiconductor Location

Ref. No. Location

D801	D-6
IC301	A-3
Q301	A-3

E	S804	S805	S801	S803	S802
	VOLUME–	VOLUME+	x	.	>/B

20 20

Note:

•X: parts extracted from the component side.

•z : Through hole.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Pattern face side:	Parts on the pattern face side seen from the
(Side B)	pattern face are indicated.
Parts face side:	Parts on the parts face side seen from the
(Side A)	parts face are indicated.