Sony 4-216-349-0 US model 4-216-349-1 Canadian model 4-216-349-2 AEP, 4-216-349-5, Hong Kong model, Singapore model, UK model 4-216-349-3 Australian model 4-216-349-4

MDS-JE330

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6-5.SCHEMATIC DIAGRAM – BD (2/2) SECTION –

• See page 34 for Waveforms.

• See page 35 for Printed Wiring Board.

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BA033FP-E2

Contents

Main MDS-JE330 SERVICE MANUAL MINIDISC DECK SELF-DIAGNOSIS FUNCTION ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS Page Fig. A. Using an AC voltmeter to check AC leakage. TABLE OF CONTENTS 1. SERVICING NOTE 2. GENERAL 3. DISASSEMBLY 4. TEST MODE 5. ELECTRICAL ADJUSTMENTS 6. DIAGRAMS 8. ELECTRICAL PARTS LIST 7. EXPLODED VIEWS SECTION 1 SERVICING NOTE JIG FOR CHECKING BD BOARD WAVEFORM Page CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS FORCED RESET RETRY CAUSE DISPLAY MODE Fig. 1 Reading the Test Mode Display (During recording and stop) Fig. 2 Reading the Test Mode Display (During playback) Hexadecimal Binary Conversion Table LOCATION OF PARTS AND CONTROLS SECTION 2 GENERAL 2 4 6 7 89101112135 13141516 171819 SECTION 3 DISASSEMBLY 3-1. CASE AND FRONT PANEL Two screws (Case) Front panel assembly Five screws (BVTP3x8) 3-4. SW BOARD AND LOADING MOTOR (M103) 3-3. BASE UNIT (MBU-5A) AND BD BOARD SECTION 4 TEST MODE 4-1. PRECAUTIONS FOR USE OF TEST MODE 4-2. SETTING THE TEST MODE 4-3. EXITING THE TEST MODE 4-4. BASIC OPERATIONS OF THE TEST MODE 4-5. SELECTING THE TEST MODE D: Develop Group (*) C: Check S: Service A: Adjust Page 4-6. FUNCTIONS OF OTHER BUTTONS 4-7. TEST MODE DISPLAYS MEANINGS OF OTHER DISPLAYS 5-1. PARTS REPLACEMENT AND ADJUSTMENT Check and adjust the MDM and MBU as follows. The procedure changes according to the part replaced SECTION 5 ELECTRICAL ADJUSTMENTS Abbreviation OP : Optical pick-up OWH: Overwrite head 5-2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSINON 5-3.PRECAUTIONS FOR USE OF OPTICAL PICK- UP (KMS-260A) Optical pick-up flexible board 5-4. PRECAUTIONS FOR ADJUSTMENTS 5-5. CREATING CONTINUOUSLY RECORDED DISC 5-6. CHECKS PRIOR TO REPAIRS Page 5-7. INITIAL SETTING OF ADJUSTMENT VALUE 5-8. RECORDING AND DISPLAYING THE IOP INFORMATION 5-9. TEMPERATURE COMPENSATION OFFSET ADJUTMENT 5-10. LASER POWER ADJUSTMENT 5-11. TRAVERSE ADJUSTMENT 5-12. FOCUS BIAS ADJUSTMENT 5-13. ERROR RATE CHECK 5-14. FOCUS BIAS CHECK 5-15. AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 5-15. ADJUSTING POINTS AND CONNECTING POINTS Page 29 30 6-2. BLOCK DIAGRAMS BD SECTION (Page 31) TX WBLADJ MDS-JE330 31 32 MAIN SECTION (Page 30) R-ch is omitted. Signal path : PB : REC : PB (Digital out) : REC (Digital in) 33 34 WAVEFORMS BD (1/2) SECTION MAIN SECTION DISPLAY SECTION d Q 35 36 (Page 45) (Page 45) Semiconductor Location Page Page 41 42 Page 45 46 Semiconductor Location 6-8.PRINTED WIRING BOARD MAIN SECTION (Page 51) (Page 36) (Page 48) 47 48 (Page 45) Page 6-12. PRINTED WIRING BOARD BD SWITCH SECTION 6-11. SCHEMATIC DIAGRAM BD SWITCH SECTION 51 52 (Page 41) (Page 45) 6-13. IC BLOCK DIAGRAMS BD Section IC101 CXA2523AR 53 IC121 CXD2654R IC152 BH6511FS-E2 54 IC301 UDA1341TS/N2 IC441 LB1641 VSS(AD) DAC 55 6-14. IC PIN FUNCTIONS 56 57 58 59 60 61 SECTION 7 EXPLODED VIEWS 62 63 64 65 SECTION 8 ELECTRICAL PARTS LIST BD 66 BD DISPLAY 67 KEY SW DISPLAY 68 69 SW VOL SEL 70 Sony Corporation 9-928-830-11

Sony - page 34

Models: 4-216-349-0 US model 4-216-349-1 Canadian model 4-216-349-2 AEP 4-216-349-5 Hong Kong model Singapore model UK model 4-216-349-3 Australian model 4-216-349-4