Advanced Data Sheet: Veta® iHA48060A012V*, 1.2V/60A Output Half Brick
Thermal Management:
An important part of the overall system design process is thermal management; thermal design must be considered at all levels to ensure good reliability and lifetime of the final system. Superior thermal design
top of the module and a parallel facing PCB kept at a constant (0.5 in). The power module’s orientation with respect to the airflow direction can have a significant impact on the unit’s thermal performance.
and the ability to operate in severe application environments are key elements of a robust, reliable power module.
A finite amount of heat must be dissipated from the power module to the surrounding environment. This heat is transferred by the three modes of heat transfer: convection, conduction and radiation. While all three modes of heat transfer are present in every application, convection is the dominant mode of heat transfer in most applications. However, to ensure adequate cooling and proper operation, all three modes should be considered in a final system configuration.
Module
Centerline
76 (3.0)
AIRFLOW
Adjacent PCB
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I | (0.50) | |
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The open frame design of the power module provides an air path to individual components. This air path improves convection cooling to the surrounding environment, which reduces areas of heat concentration and resulting hot spots.
Test Setup: The thermal performance data of the power module is based upon measurements obtained from a wind tunnel test with the setup shown in the wind tunnel figure. This thermal test setup replicates the typical thermal environments encountered in most modern electronic systems with distributed power architectures. The electronic equipment in networking, telecom, wireless, and advanced computer systems operates in similar environments and utilizes vertically mounted (PCBs) or circuit cards in cabinet racks.
The power module is mounted on a 0.062 inch thick, 6 layer, 2oz/layer PCB and is vertically oriented within the wind tunnel. Power is routed on the internal layers of the PCB. The outer copper layers are thermally decoupled from the converter to better simulate the customer’s application. This also results in a more conservative derating.
The cross section of the airflow passage is rectangular with the spacing between the
Air Velocity and Ambient Temperature | Air Passage | |
Measurement Location | ||
Centerline | ||
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Wind Tunnel Test Setup Figure
Dimensions are in millimeters (inches)
Thermal Derating: For proper application of the power module in a given thermal environment, output current derating curves are provided as a design guideline in the Thermal Performance section for the power module of interest. The module temperature should be measured in the final system configuration to ensure proper thermal management of the power module. For thermal performance verification, the module temperature should be measured at the
location indicated in the thermal measurement location figure in the Thermal Performance section for the power module of interest. In all conditions, the power module should be operated below the maximum operating temperature shown on the derating curve. For improved design margins and enhanced system reliability, the power module may be operated at temperatures below the maximum rated operating temperature.
©2007 TDK Innoveta Inc. | ' (877) |
iHA Datasheet 040207 | 11/16 |
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