Texas Instruments MSOP8 manual EVM BOM and Schematic, 1. Bill of Materials, Topic, Page, Chapter

Chapter 6

EVM BOM and Schematic

The following table contains a complete bill of materials for the modular MSOP8 EVM bill of materials.

Table 6 - 1. Bill of Materials

	Designators		Description	Manufacturer	Mfg. Part Number
C2	C3 C4 C13	Not Installed
R11		Not Installed
C1		0.47 µF, 0805, ceramic, X7R, 25 V, 10%		Panasonic	ECJ - 2YB1C474K
C11 C12 C14		0.1 µF, 0805, ceramic, X7R, 50 V, 10%		Panasonic	ECJ - 2YB1H104K
C6	C8 C10	10	µF, 1206, ceramic, Y5V, 10 V, 10%	Panasonic	ECJ - 3YF1A106Z
C5	C14 C15	10	µF, A case, tantalum, 10 V	Panasonic	ECS - T1AY106R
L1 L2 L3		15	µH inductor, SMT, 1608 Series	Inductors, Inc.	CTDS1608C- 153
J1 J2 (top side)		10	Pin, dual row, SMT header (20 [postive)	Samtec	TSM- 110- 01- T- DV - P
J1B J2B (bottom side)		10	Pin, dual row, SMT socket (20 positive)	Samtec	SSW- 110- 22- F- D - VS- K
J3 (bottom side)		5 Pin, dual row, SMT socket (10 posotove)		Samtec	SSW- 105- 22- F- D - VS- K
R9 R10 R12		33	Ω, 0805, 5%, .1W Resistor	Yageo America	9C08052A33R0JLHFT
R1	R2 R3 R4 R6	0 Ω, 0805, 0.1 W resistor		Yageo America	9C08052A0R00JLHFT
TP1 TP2 TP3 TP5 TP7		Red test point loop		Keystone	5001
TP4 TP6		Black test point loop		Keystone	5000
U1		Varies (see Note)
U2		REF3025		TI	REF3025AIDBZT
U3 U5 U6		SN74LVC1G125		TI	SN74LVC1G125DBVT
U4		OPA353N		TI	OPA353NA/250
JMP1 JMP2 JMP5		3 Pin , 2 mm header		Samtec	TMMH- 103- C - S- T
JMP6
JMP3		4 Pin, dual row, TH header (8 positive)		Samtec	TSW- 104- 07- L- D

Note: The device installed at location U1 is dependent on the EVM ordered. This device is soldered to the board for best perfor- mance. U1 may be replaced with any device listed in the EVM compatible device data sheets table found at the beginning of this document.

Topic Page

6.1 EVM Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2

EVM BOM and Schematic 6-1