Bill of Materials

www.ti.com

2.3Bill of Materials

Table 2.4. Bill of Materials

 

QTY

 

REFDES

VALUE

DESCRIPTION

SIZE

PART NUMBER

MFR

-01

-02

-03

 

 

 

 

 

 

1

1

1

Two-layer, 2420 × 2320 mil, PCB

2420 × 2320 mil

HPA393

Any

2

2

2

C1, C6

1 μF

Capacitor, ceramic, 25 V, X5R

805

GRM216R61E1

STD

05KA12D

 

 

 

 

 

 

 

 

1

1

1

C2

10 μF

Capacitor, ceramic, 16 V, X5R

805

GRM21BR61C1

STD

06KE15L

 

 

 

 

 

 

 

 

1

1

1

C5

0.1 μF

Capacitor, ceramic, 25 V, X7R

805

GRM21BR71E1

STD

04KA01L

 

 

 

 

 

 

 

 

0

0

0

C3, C4,

Capacitor, ceramic, 16 V, X5R

805

STD

C7, C8

 

 

 

 

 

 

 

 

 

 

 

 

 

Header, 3 × 1 pin, 100 mil spacing

0.100 × 0.100 in

 

Sullins

1

1

1

J2

PEC36SAAN

Connector

 

 

 

 

 

 

 

 

Solutions

 

3

 

 

 

 

0.100 × 0.100 in

 

Sullins

3

 

3

J4, J5, J6

Header, 4 x 2 pin, 100 mil spacing

PEC36DAAN

Connector

 

 

 

 

 

 

 

 

Solutions

2

2

2

J1, J3

Terminal block, 6A, 125 V, 3.5-mm

7 × 6.5 mm

ED555/2DS

OnShore

 

pitch

Technology

 

 

 

 

 

 

 

1

1

1

R1

10 kΩ

Resistor, chip, 1/8 W, 5%

805

ERJ-

STD

6GEYJ103V

 

 

 

 

 

 

 

 

1

1

1

R2

33 Ω

Resistor, chip, 1/8 W, 5%

805

ERJ-

STD

6GEYJ330V

 

 

 

 

 

 

 

 

1

1

1

R3

330 Ω

Resistor, chip, 1/8 W, 5%

805

ERJ-

STD

6GEYJ331V

 

 

 

 

 

 

 

 

0

0

0

R4, R5

Resistor, chip, 1/8 W, 5%

805

STD

1

0

0

U1

TPS22921

IC, ultra-small, low-input voltage, low

YFP/0.4-mm pitch WCSP

TPS22921YFPR

TI

 

rON load switch

 

 

 

 

 

 

 

 

0

1

0

U1

TPS22922

IC, ultra-small, low-input voltage, low

YFP/0.4-mm pitch WCSP

TPS22922YFPR

TI

rON load switch

 

 

 

 

 

 

 

 

0

0

1

U1

TPS22922B

IC, ultra-small, low-input voltage, low

YFP/0.4-mm pitch WCSP

TPS22922BYFP

TI

rON load switch

R

 

 

 

 

 

 

 

 

 

 

 

 

 

0.100 × 0.256 in

 

Sullins

3

3

3

Conn. jumper, shorting, gold, flash

SPC02SYAN

Connector

 

 

 

 

 

 

 

 

Solutions

4

4

4

Bumpon, hemisphere, .44 × .20, clear

11.1 mm × 5.1 mm

SJ-5303

3M

8

Schematics and Bill of Materials

SLVU286–January 2009

Submit Documentation Feedback

Page 8
Image 8
Texas Instruments TPS22921, TPS22922B manual Bill of Materials