Bill of Materials | www.ti.com |
2.3Bill of Materials
Table 2.4. Bill of Materials
| QTY |
| REFDES | VALUE | DESCRIPTION | SIZE | PART NUMBER | MFR | |
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1 | 1 | 1 | – | – | 2420 × 2320 mil | HPA393 | Any | ||
2 | 2 | 2 | C1, C6 | 1 μF | Capacitor, ceramic, 25 V, X5R | 805 | GRM216R61E1 | STD | |
05KA12D | |||||||||
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1 | 1 | 1 | C2 | 10 μF | Capacitor, ceramic, 16 V, X5R | 805 | GRM21BR61C1 | STD | |
06KE15L | |||||||||
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1 | 1 | 1 | C5 | 0.1 μF | Capacitor, ceramic, 25 V, X7R | 805 | GRM21BR71E1 | STD | |
04KA01L | |||||||||
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0 | 0 | 0 | C3, C4, | – | Capacitor, ceramic, 16 V, X5R | 805 | – | STD | |
C7, C8 | |||||||||
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| Header, 3 × 1 pin, 100 mil spacing | 0.100 × 0.100 in |
| Sullins | |
1 | 1 | 1 | J2 | – | PEC36SAAN | Connector | |||
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| Solutions | |
| 3 |
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| 0.100 × 0.100 in |
| Sullins | |
3 |
| 3 | J4, J5, J6 | – | Header, 4 x 2 pin, 100 mil spacing | PEC36DAAN | Connector | ||
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| Solutions | |
2 | 2 | 2 | J1, J3 | – | Terminal block, 6A, 125 V, | 7 × 6.5 mm | ED555/2DS | OnShore | |
| pitch | Technology | |||||||
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1 | 1 | 1 | R1 | 10 kΩ | Resistor, chip, 1/8 W, 5% | 805 | ERJ- | STD | |
6GEYJ103V | |||||||||
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1 | 1 | 1 | R2 | 33 Ω | Resistor, chip, 1/8 W, 5% | 805 | ERJ- | STD | |
6GEYJ330V | |||||||||
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1 | 1 | 1 | R3 | 330 Ω | Resistor, chip, 1/8 W, 5% | 805 | ERJ- | STD | |
6GEYJ331V | |||||||||
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0 | 0 | 0 | R4, R5 | – | Resistor, chip, 1/8 W, 5% | 805 | – | STD | |
1 | 0 | 0 | U1 | TPS22921 | IC, | TPS22921YFPR | TI | ||
| rON load switch | ||||||||
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0 | 1 | 0 | U1 | TPS22922 | IC, | TPS22922YFPR | TI | ||
rON load switch | |||||||||
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0 | 0 | 1 | U1 | TPS22922B | IC, | TPS22922BYFP | TI | ||
rON load switch | R | ||||||||
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| 0.100 × 0.256 in |
| Sullins | |
3 | 3 | 3 | – | – | Conn. jumper, shorting, gold, flash | SPC02SYAN | Connector | ||
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| Solutions | |
4 | 4 | 4 | – | – | Bumpon, hemisphere, .44 × .20, clear | 11.1 mm × 5.1 mm | 3M |
8 | Schematics and Bill of Materials |