Toshiba 14N21NS service manual Removal and Installation of Flat Package IC, B2-1

DISASSEMBLY INSTRUCTIONS

2.REMOVAL AND INSTALLATION OF FLAT PACKAGE IC

REMOVAL

1.Put the Masking Tape (cotton tape) around the Flat Package IC to protect other parts from any damage.

(Refer to Fig. 2-1.)

NOTE

Masking is carried out on all the parts located within 10 mm distance from IC leads.

Masking Tape	IC
(Cotton Tape)

Fig. 2-1

2.Heat the IC leads using a blower type IC desoldering machine. (Refer to Fig. 2-2.)

NOTE

Do not add the rotating and the back and forth directions force on the IC, until IC can move back and forth easily after desoldering the IC leads completely.

Blower type IC desoldering machine

3.When IC starts moving back and forth easily after desoldering completely, pickup the corner of the IC using a tweezers and remove the IC by moving with the IC desoldering machine. (Refer to Fig. 2-3.)

NOTE

Some ICs on the PCB are affixed with glue, so be careful not to break or damage the foil of each IC leads or solder lands under the IC when removing it.

Blower type IC desoldering machine

Tweezers

IC

Fig. 2-3

4.Peel off the Masking Tape.

5.Absorb the solder left on the pattern using the Braided Shield Wire. (Refer to Fig. 2-4.)

NOTE

Do not move the Braided Shield Wire in the vertical direction towards the IC pattern.

Braided Shield Wire

Soldering Iron

IC

Fig. 2-2

IC pattern Fig. 2-4

B2-1