64 65
Package List
LQFP
20 20
LQFP
16 16
QFP
14 20
TQFP/LQFP/
QFP
14 14
LQFP
12 12
LQFP
10 10
LQFP
77
SSOP-300
10 6
SOP-450
18 8
SOP-300
13 5
SOP-300
10 5
FBGA
15
LQFP
20 20
LQFP
16 16
QFP
14 20
TQFP/LQFP/
QFP
14 14
LQFP
12 12
LQFP
10 10
LQFP
77
SSOP-300
10 6
SOP-450
18 8
SOP-300
13 5
SOP-300
10 5
20 2816 30 6448 8044 100 144128 228160
FBGA
15 15
QFP
28 28
QFP
28 28
Size
(mm) ■ The number above each photograph (actual size) indicates the pin pitch (mm).
Number
of pins
0.65
0.5
0.5
0.5
0.8
0.8
1.0
0.5
0.8
0.4
0.4
0.8
0.65
1.27
1.27
1.27
0.65
0.5
(Top) (Bottom)
Package pin pitch table
SDIP20 SDIP32
SDIP/SOP/SSOP/QFP/FBGA packages for 4-/8-/16-/32-bit microcontrollers
Package Pin Pitch
64
44
44
64
64
48
80
80
100
100
100 144
144
160
100
128
Number of pins
QFP
1.0mm
0.8mm
0.65mm
0.5mm
0.8mm
0.5mm
0.4mm
0.5mm
0.4mm
LQFP
TQFP
Microcomputer package summary
To meet customers' needs Toshiba provides a wide range of highly reliable packages for high-density mounting. In
particular, Toshiba's miniature packages for portable applications offer extensive choices ranging to products as
compact as 144-pin and 0.4-mm pitch.