Figure 31. Front-to-Back Air Flow
It may be necessary to enclose the area around a CMM when cooled
11.4Airflow Requirements
General airflow requirements for the CMM are shown in Table 23.
Table 23. Typical Airflow and Cooling Requirements
Category | CMMs |
|
|
Required LFM | 180 LFM (54.864 m/min) |
|
|
Required CFM | 5 CFM (0.1416 m3/min) per CMM |
Typical Heat Dissipation | 21 W per CMM |
|
|
Maximum Heat Dissipation | 28 W per CMM |
|
|
Approximate Airflow Resistance | 0.2 |
11.5Board Resistance Curve
As described in Chapter 5 of the PICMG* 3.0 specification, all board vendors are required to provide a flow pressure curve for their board along with the airflow requirements for specific wattages. This enables system integrators to compare the slot resistance curves of their shelves with the resistance and airflow requirements of their blades to approximate whether a given chassis can cool a particular blade.
The MPCMM0002 CMM is not subject to this requirement because the board is not an AdvancedTCA standard form factor. Flow pressure curves will vary widely depending upon location of the MPCMM0002 CMM in a chassis and the type/amount of airflow across the MPCMM0002 CMM at that location.
| Intel NetStructure® MPCMM0002 Chassis Management Module |
July 2007 | Hardware TPS |
Order Number: | 57 |
