Intel 6300ESB manual 3.0Thermal Specifications, 3.1Case Temperature and Thermal Design Power

Thermal Specifications

3.0Thermal Specifications

3.1Case Temperature and Thermal Design Power

To ensure proper operation and reliability of the Intel 6300ESB ICH component, the case and junction temperatures must be at or below the values specified in Table 3. System and/or component level thermal solutions are required to maintain the case temperature below the maximum temperature specification while dissipating the thermal design power (TDP) listed in Table 3.

Table 3. Intel® 6300ESB I/O Controller Hub Thermal Specifications

Parameter	Maximum	Notes
Tcase-nhs	105 °C	1
Tj-max	115 °C	2
TDP	3.9 W

NOTES:

1.Tcase-nhsis defined as the maximum package case temperature without a thermal solution attached.

2.Tj-maxis defined as the maximum component temperature specification measured at the hottest point in the processor die.

3.2Case Temperature Metrology

The component case temperature should be measured by attaching a thermocouple to the geometric center of the package case top. Refer to Appendix A, “Mechanical Drawings” for package dimensions.

Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 9