Intel IXD1110 manual Power Test Points Sheet 2, Ground Test Points

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IXD1110 Demo Board

Table 9. Power Test Points (Sheet 2 of 2)

Test Point

Symbol

Description

 

 

 

TP20

Vdd_3P3

3.3 V rest of the board

 

 

 

TP22

TxAVTT_A

SerDes Tx Block A 1.8 V

 

 

 

TP23

TxAVTT_B

SerDes Tx Block B 1.8 V

 

 

 

TP24

RxAVTT_C

SerDes Rx Block C 1.8 V

 

 

 

TP25

RxA25_A

SerDes Rx Block A 2.5 V

 

 

 

TP26

RxAVTT_A

SerDes Rx Block A 1.8 V

 

 

 

TP27

TxA25_B

SerDes Tx Block B 2.5 V

 

 

 

TP28

RxA25_B

SerDes Rx Block B 2.5 V

 

 

 

TP29

RxAVTT_B

SerDes Rx Block B 1.8 V

 

 

 

TP30

TxAVTT_C

SerDes Tx Block C 1.8 V

 

 

 

TP31

RxA25_C

SerDes Rx Block C 2.5 V

 

 

 

NOTE: TP = Test Point

Table 10 lists the various ground test points provided on the IXD1110 demo board.

Table 10. Ground Test Points

Test Point

Symbol

Description

 

 

 

TP10

 

 

 

 

 

TP11

 

 

 

 

 

TP12

 

 

 

 

 

TP13

GND

Ground Test Points

 

TP14

 

 

 

 

 

TP15

 

 

 

 

 

TP16

 

 

 

 

 

TP17

 

 

 

 

 

NOTE: TP = Test Point

 

 

 

 

Development Kit Manual

23

Document Number: 250807

Revision Number: 003

Revision Date: June 27, 2003

Image 23
Contents Development Kit Manual Intel IXD1110 Demo BoardDevelopment Kit Manual Contents Tables FiguresRevision History Contents Additional Equipment Required IntroductionAbout This Kit About The IXD1110 Demo Board FeaturesComponent Description Intel IXD1110 Demo Board Principal ComponentsFpga Quick Start SetupTypical Test Setup Typical Test SetupIntel IXF1110 CPU Daughter Card CPU Daughter CardIXF1110 Register Modifications on Startup CPU FpgaPC Requirements IXF1110 SoftwareChanging the IP Address of the CPU Daughter Card Optional Installing the IXF1110 SoftwareDram OK Jtag Test Signals JP1 Optional ConfigurationsReset Jumper JP2 Jtag Test SignalsIXF1110 LED Behavior LEDsGbic Test Points Reset Test PointsTest Points IXF1110 Input Clock Test PointsGbic Test Points Sheet 2 Mictor ConnectorsMictor Connector Test Points Sheet 1 Test Point Symbol Description Power and Ground Test PointsMictor Connector Test Points Sheet 2 Power Test Points Sheet 1Ground Test Points Power Test Points Sheet 2Test Points Description Unused Test PointsUnused Test Points IXD1110 Demo Board Power Revision A1 SchematicsGND Digital Power1.8Digital Power 2.5 Analog Power Intel IXD1110 Analog PowerControl I2C Data I2CDATA4 I2CDATA3MODDEF3 MODDEF0 I2CDATA4IXF0MODDEF6 AB9AC9 I2CDATA6I2CDATA9IXF0 IXD1110SerDes/GBIC Port MODDEF9 L1IXD1110 SPI4-2 SPI-4 Phase 2 RXSPI-4 Phase 2 TX Rclk SERSrclk Srclr+3.3V PowerIXF1110 & CPU Interfaces +2.5VConnectors GND CLK2 CLK0 CLK1 CLK3GND GND GND GND GND Reference Designator Description Manufacturer Part Number Bill of MaterialsIntel IXD1110 Demo Board Bill of Materials Rev. A1 Misc Bottom Testpoint

IXD1110 specifications

The Intel IXD1110 is an advanced integrated circuit that serves as a highly efficient and versatile solution for various communication and data processing applications. Built on Intel's cutting-edge technology, the IXD1110 showcases enhanced performance characteristics tailored for modern industrial and embedded systems.

One of the most notable features of the IXD1110 is its robust processing capability. Designed to support high-speed data transfer, this device operates with a clock frequency of up to 500 MHz. Such a high processing speed ensures that the IXD1110 can handle data-heavy applications with ease, making it an ideal choice for real-time data processing tasks.

In terms of connectivity, the IXD1110 boasts multiple communication interfaces. It supports Ethernet, SPI, and I2C protocols, allowing seamless integration into various system architectures. The Ethernet interface ensures high-bandwidth connectivity, giving developers the flexibility to connect the IXD1110 to both wired and wireless networks. This opens up possibilities for IoT (Internet of Things) applications, where reliable and fast communication is critical.

Another standout feature of the IXD1110 is its low-power consumption, which is a significant consideration for embedded systems and battery-powered devices. Intel has implemented advanced power management technologies in the IXD1110, enabling it to operate efficiently while minimizing energy usage. This characteristic not only extends the lifespan of the devices it powers but also reduces overall operational costs.

The IXD1110 also includes advanced security features, catering to the growing demand for secure processing in connected devices. Integrated hardware security mechanisms help safeguard against vulnerabilities and attacks, ensuring data integrity and protecting sensitive information.

Additionally, the IXD1110 is designed for scalability, allowing developers to adapt the device to a wide range of applications, from automotive systems to industrial automation. Its flexible architecture accommodates future upgrades and enhancements, making it a long-term investment for companies looking to future-proof their systems.

In conclusion, the Intel IXD1110 stands out with its high processing speeds, versatile connectivity options, low power consumption, advanced security features, and scalability. These attributes make it a compelling choice for organizations looking to leverage cutting-edge technology in their communication and data processing systems. As industries continue to evolve towards greater connectivity and automation, the IXD1110 is positioned as a key enabler in this technological transformation.