Intel IXD1110 manual Testpoint

Page 40

IXD1110 Demo Board

Table 12. Intel® IXD1110 Demo Board Bill of Materials (Rev. A1) (Continued)

Reference Designator

Description

Manufacturer1

Part Number

 

TESTPOINT

Components Corp.

 

TP2-17, 19-21

SILVER LOOP

TP-108-02

(Lab stock-reel)

 

(SMD)

 

 

 

 

 

 

 

 

U1

IC MAC IXF1110 10

Intel

IXF1110

PORT

 

 

 

 

 

 

 

U3

OSC 125 MHZ 3.3V

Pletronics

SM7744DSV-125.0M

4 PIN SMD

 

 

 

 

 

 

 

U4

OSC 50.0 MHZ

Pletronics

SM7744HSV-50.0M

3.3V 4 PIN SMD

 

 

 

 

 

 

 

 

IC LOGIC 74HC05

 

 

U5

HEX INVERTER W/

Texas Instruments

SN74HC05D

 

OD 14 PIN SOP

 

 

 

 

 

 

U8

IC FPGA

Altera

EP1K30TC144-1

EP1K30TC144-1

 

 

 

 

 

 

 

 

IC LOGIC

 

 

U10-13

74HC595 8 BIT

Fairchild

MM74HC595M

SHIFT REGISTER

Semiconductor

 

 

 

16 PIN SOIC

 

 

 

 

 

 

SOCKET FOR U18

SOCKET 8 PIN DIP

MILL--Max

110-93-308-41-001

GOLD

Manufacturing Corp

 

 

 

 

 

 

 

IC MEM PROM

 

 

U18

EPC1PC8 ALTERA

Altera

EPC1PC8

 

8 PIN DIP (DIP8)

 

 

 

 

 

 

 

CONN 38 PIN

 

 

U19-21

MICTOR PLUG

AMP

2-767004-2

 

CONNECTOR ( )

 

 

 

 

 

 

 

MISC LATCH

Precision

 

LATCH HOUSING FOR U19-21

HOUSING FOR

105-1089-00

Interconnect

 

MICTOR RECPT

 

 

 

 

 

 

 

 

 

IC LOGIC

 

 

U22

NC7SZ125

Fairchild

NC7SZ125M5

SINGLE TRISTATE

Semiconductor

 

 

 

BUFFER SOT23

 

 

 

 

 

 

 

IC LOGIC 74LV08

 

 

U23

QUAD 2-INPUT

Texas Instruments

SN74LV08AD

 

AND GATE 14 SOP

 

 

 

 

 

 

1. Third-party brands and names are the property of their respective owners.

40

Development Kit Manual

Document Number: 250807

Revision Number: 003

Revision Date: June 27, 2003

Image 40
Contents Intel IXD1110 Demo Board Development Kit ManualDevelopment Kit Manual Contents Figures TablesRevision History Contents About This Kit IntroductionAdditional Equipment Required Features About The IXD1110 Demo BoardIntel IXD1110 Demo Board Principal Components Component DescriptionFpga Setup Quick StartTypical Test Setup Typical Test SetupCPU Daughter Card Intel IXF1110 CPU Daughter CardCPU Fpga IXF1110 Register Modifications on StartupIXF1110 Software PC RequirementsInstalling the IXF1110 Software Changing the IP Address of the CPU Daughter Card OptionalDram OK Optional Configurations Reset Jumper JP2Jtag Test Signals Jtag Test Signals JP1LEDs IXF1110 LED BehaviorReset Test Points Test PointsIXF1110 Input Clock Test Points Gbic Test PointsMictor Connector Test Points Sheet 1 Mictor ConnectorsGbic Test Points Sheet 2 Power and Ground Test Points Mictor Connector Test Points Sheet 2Power Test Points Sheet 1 Test Point Symbol DescriptionPower Test Points Sheet 2 Ground Test PointsUnused Test Points Unused Test PointsTest Points Description Schematics IXD1110 Demo Board Power Revision A1Digital Power 2.5 Digital Power1.8GND Intel IXD1110 Analog Power Analog PowerControl I2C Data I2CDATA3 MODDEF3 MODDEF0I2CDATA4IXF0 I2CDATA4AB9 AC9I2CDATA6 MODDEF6IXD1110 SerDes/GBIC PortMODDEF9 L1 I2CDATA9IXF0SPI-4 Phase 2 TX SPI-4 Phase 2 RXIXD1110 SPI4-2 SER SrclkSrclr RclkPower IXF1110 & CPU Interfaces+2.5V +3.3VConnectors GND GND GND GND GND CLK0 CLK1 CLK3GND CLK2 Intel IXD1110 Demo Board Bill of Materials Rev. A1 Bill of MaterialsReference Designator Description Manufacturer Part Number Misc Bottom Testpoint

IXD1110 specifications

The Intel IXD1110 is an advanced integrated circuit that serves as a highly efficient and versatile solution for various communication and data processing applications. Built on Intel's cutting-edge technology, the IXD1110 showcases enhanced performance characteristics tailored for modern industrial and embedded systems.

One of the most notable features of the IXD1110 is its robust processing capability. Designed to support high-speed data transfer, this device operates with a clock frequency of up to 500 MHz. Such a high processing speed ensures that the IXD1110 can handle data-heavy applications with ease, making it an ideal choice for real-time data processing tasks.

In terms of connectivity, the IXD1110 boasts multiple communication interfaces. It supports Ethernet, SPI, and I2C protocols, allowing seamless integration into various system architectures. The Ethernet interface ensures high-bandwidth connectivity, giving developers the flexibility to connect the IXD1110 to both wired and wireless networks. This opens up possibilities for IoT (Internet of Things) applications, where reliable and fast communication is critical.

Another standout feature of the IXD1110 is its low-power consumption, which is a significant consideration for embedded systems and battery-powered devices. Intel has implemented advanced power management technologies in the IXD1110, enabling it to operate efficiently while minimizing energy usage. This characteristic not only extends the lifespan of the devices it powers but also reduces overall operational costs.

The IXD1110 also includes advanced security features, catering to the growing demand for secure processing in connected devices. Integrated hardware security mechanisms help safeguard against vulnerabilities and attacks, ensuring data integrity and protecting sensitive information.

Additionally, the IXD1110 is designed for scalability, allowing developers to adapt the device to a wide range of applications, from automotive systems to industrial automation. Its flexible architecture accommodates future upgrades and enhancements, making it a long-term investment for companies looking to future-proof their systems.

In conclusion, the Intel IXD1110 stands out with its high processing speeds, versatile connectivity options, low power consumption, advanced security features, and scalability. These attributes make it a compelling choice for organizations looking to leverage cutting-edge technology in their communication and data processing systems. As industries continue to evolve towards greater connectivity and automation, the IXD1110 is positioned as a key enabler in this technological transformation.