Carrier Tape Specifications
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| 12.0 ±0.1 |
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4.90 ±0.20 |
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| Ø1.55 | |||||||||||||
0.30 ±0.05 | 4.0 | ±0.1 |
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| 1.75 ±0.10 | ||||
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| 7.5 ±0.1 | |
13.2 ±0.2 | 16.0 ±0 | |
±0.20 | ||
10.30 |
0.1 MAX | 10.30 ±0.20 | Ø1.6 ±0.1 |
User Direction of Feed
Reflow Profile
| 300 |
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| 215C, |
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(°C) | 250 |
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| 225C peak |
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200 |
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Temperature |
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150 |
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| 100 |
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| Time above 183C, | ||||||||||||
| 50 |
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| Ramp up = 3C/sec |
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| 0 |
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| 0 | 0.5 | 1 | 1.5 | 2 | 2.5 | 3 | 3.5 |
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| 4.5 | |||||||
Time (Minute)
•Peak reflow temperature: 225C (package surface temperature)
•Time of temperature higher than 183C for
•One time soldering reflow is recommended
HCPL-3700 AC/DC to Logic Interface Optocoupler
©2005 Fairchild Semiconductor Corporation | www.fairchildsemi.com |
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