Texas Instruments specifications TPS53125EVM-599 Assembly Drawings and Layout

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TPS53125EVM-599 Assembly Drawings and Layout

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VIN = 12, VOUT2 = 1.80, IOUT2 = 4A

Ch1: TP11 (SW2)

Figure 10. TPS53125EVM-599 Switching Waveforms

7TPS53125EVM-599 Assembly Drawings and Layout

The following figures (Figure 11 through Figure 15) show the design of the TPS53125EVM-599 printed-circuit board. The EVM has been designed using a 4-layer, 2-oz copper-clad circuit board 3.5 in 2.7 to allow the user to easily view, probe, and evaluate the TPS53125 control IC in a practical application. Moving components to both sides of the PCB or using additional internal layers can offer additional size reduction for space-constrained systems.

Figure 11. TPS53125EVM-599 Component Placement, Viewed From Top

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TPS53125EVM-599

SLVU392 –July 2010

Copyright © 2010, Texas Instruments Incorporated

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Contents TPS53125EVM-599 Features TPS53125EVM-599 Electrical Performance SpecificationsTPS53125EVM-599 Electrical and Performance Specifications DescriptionTPS53125EVM-599 Schematic TPS53125EVM-599 SchematicConnector and Test Point Descriptions Enable Jumpers/Switches -SW1 and SW2Test Point Descriptions Test Setup EquipmentEquipment Setup Test ProcedureOther Test Equipment Start-Up/Shutdown Procedures Test Setup DiagramOutput Ripple Voltage Measurement Procedure Equipment ShutdownTPS53125EVM-599 Test Data EfficiencyLine and Load Regulation TPS53125EVM-599 Output Voltage vs Load CurrentOutput Voltage Ripple and Switching Node Waveforms TPS53125EVM-599 Output Voltage Ripple and Switching WaveformSwitch Node TPS53125EVM-599 Output Voltage RippleTPS53125EVM-599 Assembly Drawings and Layout TPS53125EVM-599 Component Placement, Viewed From TopTPS53125EVM-599 Top Copper, Viewed From Top TPS53125EVM-599 Internal 1, X-Ray View From Top TPS53125EVM-599 Bill of Materials TPS53125EVM-599 Bill of MaterialsEvaluation Board/Kit Important Notice FCC WarningEVM Warnings and Restrictions Important Notice