Texas Instruments DAC7741EVM manual PCB Layout, Layer One Top Silkscreen

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PCB Layout

2.1 PCB Layout

The EVM is constructed on a four-layer printed-circuit board using a copper-clad FR-4 laminate material. The printed-circuit board has a dimension of 99,06 mm (3.90 inch) ⋅ 104,14 mm (4.10 inch), and the board thickness is 1,57 mm (0.062 inch). Figures 2-1 through 2-6 show the individual artwork layers.

Figure 2-1. Layer One (Top Silkscreen)

2-2

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Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions Read This First About This ManualRelated Documentation From Texas Instruments Contents FiguresTables Features Power Requirements EVM Basic Functions EVM OverviewFeatures Power RequirementsEVM Basic Functions EVM Block Diagram Physical Description PCB Layout Bill of MaterialsPCB Layout Layer One Top SilkscreenLayer Two Ground Plane Layer 3 Power Plane Layer 4 Bottom Plane Drill Drawing Parts List Bill of MaterialsThis page has been left blank intentionally EVM Operation Reference Jumper Function Position Factory Default SettingFactory Default Jumper Setting Reference Unity Gain Output Jumper SettingsHost Processor Operation Unipolar BipolarReference Jumper Setting Function Gain of Two Output Jumper SettingsCapacitive Load Drive Output Jumper Settings Reference Jumper Function Jumper SettingJumper Setting Function Jumper Function Setting Schematic Schematic of the DAC7741 is found on the followingDAC7741