Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition（Reference）
1.Heating method: Double heating method with infrared heater.
2.Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）.
For | 3. Temperature profile（Surface of products）. |
| |
SD Memory |
|
Card |
|
For |
|
| 240℃(max.) |
miniSD™ |
|
| |
Card |
|
| 230℃(min.) |
For | ) |
| |
(˚C | 200 |
| |
microSD™ |
| ||
Temperature |
| ||
Card |
| 180℃ | |
|
| ||
For |
|
| 150℃ |
|
|
| |
For |
| 100 |
|
Memory |
|
|
|
Stick Micro™ | Room |
| Time (s) |
|
| ||
For | temperature |
| |
Memory |
|
| |
Stick™ |
| 90±30 sec. | 10 sec.(max.) |
Combine Type |
|
|
|
|
| Heating time | sec. |
For
Compact
Flash™
For PC cards supporting CardBus
For
Express
Card™
For CMOS Camera Module
Cautions
1.When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required.
2.Avoid use of
3.Check and conform to reflow soldering requirements under actual mass production conditions.
4.PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout.
5.This product has been designed and manufactured for use in ordinary electronic equipment, such as AV equipment, electric home appliances, office machines and communication equipment. In case of using the products for highly sensitive applications such as medical, aviation, aerospace and security, the set makers shall require to include measures necessary to meet product safety requirements of such specific applications. Such measure may include additional protection circuits and redundant circuits, for example.
6.The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.
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