TDK 73M2901/5V manual TDK Semiconductor Corp, Description, Features, Block Diagram

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TDK SEMICONDUCTOR CORP.

73M2901/5V Advanced Single Chip Modem

August 2001

DESCRIPTION

The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprietary multiply and accumulate (MAC) coprocessor; Sigma- Delta A/D and D/A converters; and an analog front end. The ROM and RAM necessary to operate the modem are contained on the device. Additionally, the 73M2901/5V provides an on-chip oscillator and Hybrid driver.

The 73M2901/5V is a high performance, low voltage, low power, single chip modem capable of data transmission and reception through 2400bps. The 73M2901/5V is intended for embedded applications and battery operation. This device offers options for a low power conventional 5 volt design with optional internal hybrid and country specific call progress support.

FEATURES

∙Low overall system chip count. True one chip solution for embedded systems

∙Low operating power (~250mW @ 5V, automatic low power standby and power down options available)

∙Internal ROM and RAM for normal operation

∙On chip optional hybrid driver

∙Designed for +5 volts (+/-10%)

∙Data speeds:

V.22bis – 2400bps

V.22, Bell 212 – 1200bps

V.21, Bell 103 – 300bps

V.23 – 1200/75bps (w/ turnaround (PAVI)) Bell 202 – 1200bps

Bell 202 and V23 4-wire operations

∙Dynamic Range: -9dBm to –43 dBm

∙“AT” command set

∙Host access to modem port pins via AT commands for custom I/O expansion

∙DTMF tone generation and detection

∙Call progress support with multinational options (FCC68, CTR21, JATE…)

∙Caller ID capability

∙Blacklisting capability

∙Packaging: 32 pin PLCC or 44 pin TQFP

BLOCK DIAGRAM

 

RAM

 

ROM

ASRCH

 

 

 

RING

CPU

 

MAC

DTR

 

 

TxCLK

 

 

 

TxD

 

AFE Hybrid

RxD

 

RxCLK

 

 

 

RI

 

USR10

HBDEN

 

 

CTS

 

 

 

USR11

 

DCD

 

 

 

RELAY

 

DSR

 

 

 

 

 

RTS

 

 

 

RxA

TxAP

TxAP

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Contents Block Diagram FeaturesTDK Semiconductor Corp DescriptionHardware Description PIN Descriptions Digital Interface PIN Description PIN Name Oscillator PIN Description PIN NameAbsolute Maximum Ratings Electrical SpecificationsParameter Rating Recommended Operating Conditions Parameter RatingMaximum Transmit Levels Electrical SpecificationsReceiver Parameter Conditions MIN NOM MAX Unit Parameter Test Condition MIN NOM MAX Units 5V Operations DC Characteristics Parameter Condition MIN NOM MAX UnitFirmware DESCRIPTION2 Firmware Requirements Firmware FeaturesDesign Considerations Modem Performance CharacteristicsRecommended Schematics Arrangement Typical USA Application Schematics BER VS SNR 22bis 3002A Line, 5.0V, 25CPIN Tqfp PIN-OUT PIN Name PIN Plcc PIN-OUT PIN NameMechanical Drawings Mechanical Drawings Pin Tqfp Jedec Lqfp Package PIN Designations Ordering InformationPart Description Order Number Packaging Mark 73M2901/5V

73M2901/5V specifications

The TDK 73M2901/5V is a compact and versatile power management IC designed for a wide array of applications, particularly in portable electronic devices. This chip is part of TDK's extensive lineup of power management solutions, showcasing advanced technologies and features that cater to the evolving needs of modern electronics.

One of the standout characteristics of the TDK 73M2901/5V is its ability to support a broad input voltage range. This flexibility allows the device to operate efficiently with various power supply configurations, making it suitable for battery-operated devices, USB-powered systems, and more. Its robust design ensures that it can maintain stable performance even under fluctuating voltage conditions, a critical attribute for portable applications.

The 73M2901/5V integrates several key power management features, including voltage regulation, power distribution, and battery management functionalities. The integrated voltage regulator provides precise output voltage control, helping to preserve battery life by managing power consumption effectively. This feature is particularly essential for devices that rely on rechargeable batteries, as it enhances overall efficiency and prolongs usage times between charges.

In addition to voltage regulation, the TDK 73M2901/5V boasts advanced power distribution capabilities. The chip can intelligently manage power routing among multiple components within a device, ensuring optimal performance without unnecessary power loss. This is crucial for devices that incorporate various subsystems, needing coordinated power management to function seamlessly.

Furthermore, the 73M2901/5V includes built-in battery management capabilities that facilitate safe charging and discharging processes. This feature not only guards against overcharging and overheating but also extends the lifespan of lithium-ion and lithium-polymer batteries commonly found in consumer devices.

From a technological standpoint, the TDK 73M2901/5V utilizes cutting-edge semiconductor processes that enhance its efficiency and thermal performance. This results in reduced heat generation, allowing for compact designs without the risk of overheating. The chip is also designed for low quiescent current, which minimizes power draw during standby or idle states, further enhancing energy efficiency.

Overall, the TDK 73M2901/5V is a highly capable power management IC that combines robustness, efficiency, and advanced features. Its adaptability to various power configurations, integrated management capabilities, and modern semiconductor technologies make it an ideal choice for developers seeking reliable solutions for their portable electronic designs. As technology continues to advance, solutions like the TDK 73M2901/5V will play an increasingly vital role in powering the next generation of electronic devices.
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