TDK 73M2901/5V manual Receiver Parameter Conditions MIN NOM MAX Unit

Page 7

73M2901/5V Advanced Single Chip Modem

ELECTRICAL SPECIFICATIONS (continued)

TRANSMITTER

PARAMETER

CONDITIONS

MIN

NOM

MAX

UNIT

 

 

 

 

 

 

 

Gain Adjust

By step

 

-0.3

0

0.3

dB

Tolerance

 

 

 

 

 

 

 

 

Transmit Gain Boost

SFR 96h bit 1 (TXBOOST) = 1

4.8

5.1

5.4

dB

Total Harmonic

1Khz sine wave at output (TXAP-TXAN)

 

 

 

 

Distortion (THD)

1.5Vpk(2.7dBm) for Vref=1.25V

 

 

-50

dB

 

2.4Vpk (6.8dBm) for Vref=2.25V

 

 

 

THD = 2nd and 3rd harmonic.

 

 

 

 

 

 

 

 

 

 

 

Intermod Distortion

At output (TXAP-TXAN)

each

unwanted

 

 

 

1.0kHz, 1.2 kHz sine waves summed

frequency

-33

dB

 

2.0Vpk for Vref=1.25V

component

 

 

 

2.4Vpk for Vref=2.25V

 

 

 

 

 

Refer to CTR21 specification for complete

 

 

 

 

 

sum of

 

dB

 

description of requirements

unwanted

 

 

-20

below

 

 

 

frequency

 

 

 

low

 

 

 

components in

 

 

 

 

 

tone

 

 

 

pass band

 

 

 

 

 

 

Power Supply

-30 dBm signal at VPA

 

 

 

 

Rejection Ratio

300Hz – 30kHz. Measured TXAP to TXAN.

 

 

30.0

dB

 

 

 

 

 

 

 

RECEIVER

 

 

 

 

 

 

 

 

 

 

 

 

 

PARAMETER

 

CONDITIONS

MIN

NOM

MAX

UNIT

 

 

 

 

 

 

 

Carrier Detect On

 

Tip and Ring

-43.0

 

 

dBm01

Carrier Detect Off

 

Tip and Ring

-48.0

 

 

dBm01

Carrier Detect Hysteresis

Tip and Ring

 

2.0

 

dB

 

 

 

 

 

 

 

Receive Level

 

Tip and Ring

-43.0

 

-9.0

dBm01

Idle Channel Noise

 

0.2kHz - 4.0kHz

 

-70

-65

dB

 

 

 

 

 

 

 

7

Image 7
Contents Description FeaturesBlock Diagram TDK Semiconductor CorpHardware Description PIN Descriptions Digital Interface PIN Description PIN Name Oscillator PIN Description PIN NameRecommended Operating Conditions Parameter Rating Electrical SpecificationsAbsolute Maximum Ratings Parameter RatingMaximum Transmit Levels Electrical SpecificationsReceiver Parameter Conditions MIN NOM MAX Unit Parameter Test Condition MIN NOM MAX Units 5V Operations DC Characteristics Parameter Condition MIN NOM MAX UnitFirmware DESCRIPTION2 Firmware Requirements Firmware FeaturesDesign Considerations Modem Performance CharacteristicsRecommended Schematics Arrangement Typical USA Application Schematics BER VS SNR 22bis 3002A Line, 5.0V, 25CPIN Tqfp PIN-OUT PIN Name PIN Plcc PIN-OUT PIN NameMechanical Drawings Mechanical Drawings Pin Tqfp Jedec Lqfp Package PIN Designations Ordering InformationPart Description Order Number Packaging Mark 73M2901/5V

73M2901/5V specifications

The TDK 73M2901/5V is a compact and versatile power management IC designed for a wide array of applications, particularly in portable electronic devices. This chip is part of TDK's extensive lineup of power management solutions, showcasing advanced technologies and features that cater to the evolving needs of modern electronics.

One of the standout characteristics of the TDK 73M2901/5V is its ability to support a broad input voltage range. This flexibility allows the device to operate efficiently with various power supply configurations, making it suitable for battery-operated devices, USB-powered systems, and more. Its robust design ensures that it can maintain stable performance even under fluctuating voltage conditions, a critical attribute for portable applications.

The 73M2901/5V integrates several key power management features, including voltage regulation, power distribution, and battery management functionalities. The integrated voltage regulator provides precise output voltage control, helping to preserve battery life by managing power consumption effectively. This feature is particularly essential for devices that rely on rechargeable batteries, as it enhances overall efficiency and prolongs usage times between charges.

In addition to voltage regulation, the TDK 73M2901/5V boasts advanced power distribution capabilities. The chip can intelligently manage power routing among multiple components within a device, ensuring optimal performance without unnecessary power loss. This is crucial for devices that incorporate various subsystems, needing coordinated power management to function seamlessly.

Furthermore, the 73M2901/5V includes built-in battery management capabilities that facilitate safe charging and discharging processes. This feature not only guards against overcharging and overheating but also extends the lifespan of lithium-ion and lithium-polymer batteries commonly found in consumer devices.

From a technological standpoint, the TDK 73M2901/5V utilizes cutting-edge semiconductor processes that enhance its efficiency and thermal performance. This results in reduced heat generation, allowing for compact designs without the risk of overheating. The chip is also designed for low quiescent current, which minimizes power draw during standby or idle states, further enhancing energy efficiency.

Overall, the TDK 73M2901/5V is a highly capable power management IC that combines robustness, efficiency, and advanced features. Its adaptability to various power configurations, integrated management capabilities, and modern semiconductor technologies make it an ideal choice for developers seeking reliable solutions for their portable electronic designs. As technology continues to advance, solutions like the TDK 73M2901/5V will play an increasingly vital role in powering the next generation of electronic devices.