TDK 73M2901/5V manual Hardware Description

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73M2901/5V Advanced Single Chip Modem

HARDWARE DESCRIPTION

The 73M2901/5V is designed for a single +5 volt supply with low power consumption (~250mW @ 5 volts). The modem supports automatic standby idle mode. The modem will also accept a request to power down from the DTE via hardware control. No additional major components are required to complete the modem core logic. The modem provides direct firmware LED support via port pins.

The hybrid configuration is controlled by the state of the HBDEN pin. For driving a line-coupling transformer, HBDEN should be pulled high. For driving an external hybrid (load on TXAP and TXAN is 50kΩ or larger), HBDEN should be pulled low.

The 73M2901/5V provides firmware control for a hook relay driver (RELAY) as well as interrupt support for a ring detect opto-coupler (RING).

INTERRUPT PINS

HARDWARE FEATURES

∙Fully self-contained. “AT” Command interpreter and data pump

∙User pin available

∙Synchronous serial data I/O available

∙Asynchronous serial port

∙On-chip hybrid driver.

∙Autobaud capability from 300bps to 9600bps

POWER SUPPLY

Power is supplied to the 73M2901/5V via the VPD and VPA pins. The 73M2901/5V is designed for a single +5 (+/-10%) volt supply and for low power consumption (~250mW @ 5 volts). Ground Reference is provided at the VND and VNA pins.

LOW POWER MODE

The TDK 73M2901/5V supports a low power mode. If the low power standby option is enabled the 73M2901/5V will go into a power saving mode when idle. The oscillator will be running, clocks will be supplied to the UART, timers and interrupt blocks; but no clocks will be supplied to the CPU. Instruction processing and activity on the internal busses is halted. Normal operation is resumed when an interruption such as DTR, RING or ASRCH (any character send to the 73M2901/5V) is requested or when a reset occurs.

ANALOG LINE / HYBRID INTERFACE

The 73M2901/5V provides a differential analog output (TXAP and TXAN) and a single-ended analog input (RXA) with internal A/D and D/A converters. A driver is provided for an internal hybrid function.

The internal hybrid driver is capable of driving an external load matching impedance and a line- coupling transformer. If an external hybrid is to be used, the on-chip hybrid drivers can be reconfigured to drive a minimum load of 50kΩ and thus reduce the driver’s power consumption.

The external interrupt sources, DTR, ASRCH and RING, come from dedicated input pins of the same name.

DTR informs the 73M2901/5V that the host has requested the 73M2901/5V perform a specific function. The actual particulars of that function can be changed by “AT” commands (described in full in the TDK 73M2901 User’s Guide).

ASRCH informs the 73M2901/5V that the host is passing data to the 73M2901/5V over the DTE interface. This instructs the 73M2901/5V to begin looking for valid “AT” commands. This pin needs to be connected to the TXD pin.

RING informs the 73M2901/5V that the external DAA circuitry has detected a ring signal.

CRYSTAL OSCILATOR

The TDK 73M2901/5V single chip modem can use an external 11.0592 MHz reference clock or can generate such a clock using only a crystal and two capacitors. If an external clock is used, it should be applied to OSCIN.

SPECIFYING A CRYSTAL

The manufacturer of a crystal resonator verifies its frequency of oscillation in a test set-up, but to ensure that the same frequency is obtained in the application, the circuit conditions must be the same. The TDK 73M2901/5V modem requires a parallel mode (antiresonant) crystal, the important specifications of which are as follows:

Mode:

Parallel (antiresonant)

 

Frequency:

11.0592 MHz

 

 

Frequency tolerance:

±50

ppm

at

initial

 

temperature.

 

 

Temperature drift:

±50 ppm additional over full

 

Range.

 

 

 

Load capacitance:

18pF or 20pF

 

 

ESR:

75Ω max.

 

 

Drive level:

Less than 1mW.

 

 

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Contents TDK Semiconductor Corp FeaturesBlock Diagram DescriptionHardware Description PIN Descriptions Oscillator PIN Description PIN Name Digital Interface PIN Description PIN NameParameter Rating Electrical SpecificationsAbsolute Maximum Ratings Recommended Operating Conditions Parameter RatingElectrical Specifications Maximum Transmit LevelsReceiver Parameter Conditions MIN NOM MAX Unit Parameter Test Condition MIN NOM MAX Units DC Characteristics Parameter Condition MIN NOM MAX Unit 5V OperationsFirmware Requirements Firmware Features Firmware DESCRIPTION2Modem Performance Characteristics Design ConsiderationsRecommended Schematics Arrangement Typical USA Application Schematics 22bis 3002A Line, 5.0V, 25C BER VS SNRPIN Plcc PIN-OUT PIN Name PIN Tqfp PIN-OUT PIN NameMechanical Drawings Mechanical Drawings Pin Tqfp Jedec Lqfp Part Description Order Number Packaging Mark Ordering InformationPackage PIN Designations 73M2901/5V

73M2901/5V specifications

The TDK 73M2901/5V is a compact and versatile power management IC designed for a wide array of applications, particularly in portable electronic devices. This chip is part of TDK's extensive lineup of power management solutions, showcasing advanced technologies and features that cater to the evolving needs of modern electronics.

One of the standout characteristics of the TDK 73M2901/5V is its ability to support a broad input voltage range. This flexibility allows the device to operate efficiently with various power supply configurations, making it suitable for battery-operated devices, USB-powered systems, and more. Its robust design ensures that it can maintain stable performance even under fluctuating voltage conditions, a critical attribute for portable applications.

The 73M2901/5V integrates several key power management features, including voltage regulation, power distribution, and battery management functionalities. The integrated voltage regulator provides precise output voltage control, helping to preserve battery life by managing power consumption effectively. This feature is particularly essential for devices that rely on rechargeable batteries, as it enhances overall efficiency and prolongs usage times between charges.

In addition to voltage regulation, the TDK 73M2901/5V boasts advanced power distribution capabilities. The chip can intelligently manage power routing among multiple components within a device, ensuring optimal performance without unnecessary power loss. This is crucial for devices that incorporate various subsystems, needing coordinated power management to function seamlessly.

Furthermore, the 73M2901/5V includes built-in battery management capabilities that facilitate safe charging and discharging processes. This feature not only guards against overcharging and overheating but also extends the lifespan of lithium-ion and lithium-polymer batteries commonly found in consumer devices.

From a technological standpoint, the TDK 73M2901/5V utilizes cutting-edge semiconductor processes that enhance its efficiency and thermal performance. This results in reduced heat generation, allowing for compact designs without the risk of overheating. The chip is also designed for low quiescent current, which minimizes power draw during standby or idle states, further enhancing energy efficiency.

Overall, the TDK 73M2901/5V is a highly capable power management IC that combines robustness, efficiency, and advanced features. Its adaptability to various power configurations, integrated management capabilities, and modern semiconductor technologies make it an ideal choice for developers seeking reliable solutions for their portable electronic designs. As technology continues to advance, solutions like the TDK 73M2901/5V will play an increasingly vital role in powering the next generation of electronic devices.
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