2.6 - Thermal Interface Material
There are two types of thermal interface materials designed for use with the AMD® Opteron™ processors.
The most common material comes as a small pad attached to the heat sink at the time of purchase. There should be a protective cover over the material. Take care not to touch this material. Simply remove the protective cover and place the heat sink on the processor.
The second type of interface material is usually packaged separately. It is commonly referred to as ‘thermal compound’. Simply apply a thin layer on to the CPU lid (applying too much will actually reduce the cooling).
Always check with the manufacturer of the heat sink & NOTE processor to ensure the Thermal Interface material is
compatible with the processor & meets the manufacturer’s warranty requirements
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