1.3Features
Enclosure
•Industry 19”
–(4) 3.5” HDD bays
–(1) slim
•Dimension: D 22.4 x W 17.2 x H 1.72 inch (568x436x43.6mm)
Processor
•(1)
•Integrated
Chipset
•Broadcom BCM5785
•SMSC SCH4307 Super I/O
Memory
•Dual channel memory bus
•(8) 240pin DIMM sockets
•Registered, ECC DDR2 module supported, up to 16GB DDR2- 667/533
Expansion Slots
•(1)
•(1) Tyan ”TARO”
Back I/O Ports
•Stacked PS/2 mouse & keyboard ports
•Stacked 2 USB 2.0 ports
•(1)
•(1)
•(2) RJ45 connectors
Front Panel Features
•I/O
–(2) USB 2.0 ports
•LED indicators
–Power LED
–(2) LAN LEDs
–ID LED
–HDD active LEDs
•Switches
–Power
–Reset
–ID
Storage
•
•(4)
Networking
•(2) Intel i8254PI GbE LAN control- lers
Video
•ATI® XGI Volari Z7 (XG20)
•16MB frame buffer memory
Motherboard
•TYAN Tomcat
•ATX footprint 12” x 10.2” (304.8mm x 259.1mm)
BIOS
•AMI BIOS on 8Mbit LCP Flash ROM
•Serial Console Redirect
•USB boot supported
•ACPI supported
•PnP, DMI2.0, WfM2.0 Power Man- agement
Server Management
•(2) SMSC EMC6D103 Hardware Monitoring IC.
•Temperature and voltage monitoring
•Watch dog timer support
•Chassis intrusion detection
System Cooling
•(4) Sunon 40*40*28mm 14500rpm
•(1) passive CPU heatsink
Power Supply
• PS 12V, 1U, 350W
Regulatory
•FCC Class B (Declaration of Con- formity)
•CE (Declaration of Conformity)
Environment Temperature
•Operating temperature 5oC~35oC
•
2 | Chapter 1: Overview |