Maxim DS5001FP specifications Msel

Page 5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DS5001FP

 

33, 35,

9

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

and A15 respectively.

 

 

37

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

71, 69,

28, 26,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Byte-WideData-Bus Bits 7–0. This 8-bit, bidirectional bus is combined with the

 

67, 65,

24, 23,

BD7–0

nonmultiplexed address bus (BA14–0) to access NV SRAM. Decoding is performed on

 

61, 59,

21, 20,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CE1 and CE2 . Read/write access is controlled by R/ W . BD7–0 connect directly to an

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

57, 55

19, 18

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SRAM, and optionally to a real-time clock or other peripheral.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Read/Write. This signal provides the write enable to the SRAMs on the byte-wide bus. It

 

10

37

 

R/

 

 

 

 

 

 

 

 

 

is controlled by the memory map and partition. The blocks selected as program (ROM) are

W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

write-protected.

 

74

29

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chip Enable 1. This is the primary decoded chip enable for memory access on the byte-

 

 

 

 

 

 

 

 

 

 

 

 

 

wide bus. It connects to the chip enable input of one SRAM.

 

is lithium-backed. It

 

 

 

CE1

 

 

 

 

 

 

 

CE1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

remains in a logic high inactive state when VCC falls below VLI.

 

72

N/A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Non-battery-backed version of chip enable 1. This can be used with a 32kB EPROM. It

 

 

CE1N

 

 

should not be used with a battery-backed chip.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chip Enable 2. This chip enable is provided to access a second 32k block of memory. It

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

connects to the chip enable input of one SRAM. When MSEL = 0, the micro converts

 

 

 

 

2

33

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CE2

 

 

 

CE2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

into A16 for a 128k x 8 SRAM. CE2 is lithium-backed and remains at a logic high when

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC falls below VLI.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chip Enable 3. This chip enable is provided to access a third 32k block of memory. It

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

connects to the chip enable input of one SRAM. When MSEL = 0, the micro converts

 

 

 

63

22

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CE3

 

 

 

CE3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

into A15 for a 128k x 8 SRAM. CE3 is lithium-backed and remains at a logic high when

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC falls below VLI.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chip Enable 4. This chip enable is provided to access a fourth 32k block of memory. It

 

62

N/A

 

 

 

 

 

 

 

 

 

 

connects to the chip-enable input of one SRAM. When MSEL = 0, this signal is unused.

 

 

 

CE4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CE4

is lithium-backed and remains at a logic high when VCC < VLI.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Peripheral Enable 1. Accesses data memory between addresses 0000h and 3FFFh when

 

78

N/A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the PES bit is set to a logic 1. Commonly used to chip enable a byte-wide real-time clock

 

 

 

 

 

PE1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

such as the DS1283. PE1 is lithium-backed and remains at a logic high when VCC falls

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

below VLI. Connect

 

to battery-backed functions only.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PE1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Peripheral Enable 2. Accesses data memory between addresses 4000h and 7FFFh when

 

3

N/A

 

 

 

 

 

 

 

 

the PES bit is set to a logic 1.

 

 

 

is lithium-backed and remains at a logic high when VCC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PE2

 

 

 

 

PE2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

falls below VLI. Connect

 

to battery-backed functions only.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PE2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Peripheral Enable 3. Accesses data memory between addresses 8000h and BFFFh when

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the PES bit is set to a logic 1.

 

is not lithium-backed and can be connected to any type

 

22

N/A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PE3

 

 

 

 

PE3

 

 

 

 

of peripheral function. If connected to a battery-backed chip, it needs additional circuitry to

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

maintain the chip enable in an inactive state when VCC < VLI.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Peripheral Enable 4. Accesses data memory between addresses C000h and FFFFh when

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the PES bit is set to a logic 1.

 

is not lithium-backed and can be connected to any type

 

23

N/A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PE4

 

 

 

 

PE4

 

 

 

 

of peripheral function. If connected to a battery-backed chip, it needs additional circuitry to

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

maintain the chip enable in an inactive state when VCC < VLI.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Invokes the bootstrap loader on a falling edge. This signal should be debounced so that

 

32

N/A

 

PROG

 

only one edge is detected. If connected to ground, the micro enters bootstrap loading on

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

power-up. This signal is pulled up internally.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

This I/O pin (open drain with internal pullup) indicates that the power supply (VCC)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

has fallen below the VCCmin level and the micro is in a reset state. When this occurs, the

 

42

N/A

 

 

VRST

 

DS5001FP drives this pin to a logic 0. Because the micro is lithium-backed, this signal is

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

guaranteed even when VCC = 0V. Because it is an I/O pin, it also forces a reset if pulled

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

low externally. This allows multiple parts to synchronize their power-down resets.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

This output goes to a logic 0 to indicate that VCC < VLI and the micro has switched to

 

43

N/A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

lithium backup. Because the micro is lithium-backed, this signal is guaranteed even when

 

 

 

 

 

PF

 

 

 

 

 

VCC = 0V. The normal application of this signal is to control lithium powered current to

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

isolate battery-backed functions from non-battery-backed functions.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Memory Select. This signal controls the memory size selection. When MSEL = +5V, the

 

14

40

MSEL

DS5001FP expects to use 32k x 8 SRAMs. When MSEL = 0V, the DS5001FP expects to

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

use a 128k x 8 SRAM. MSEL must be connected regardless of partition, mode, etc.

 

73

 

 

 

 

NC

No Connect.

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Image 5
Contents DS5001FP 128k Soft Microprocessor Chip FeaturesOrdering Information DescriptionBlock Diagram PIN Description Signal Description MqfpMsel Memory Organization Instruction SETMemory MAP in Partitionable Mode PM = Memory MAP with PES = Connection to 128k x 8 Sram DS5001FP Connection to 64k x 8 Sram Power ManagementAbsolute Maximum Ratings DC CharacteristicsDC Characteristics MAX Units AC Characteristics Expanded BUS Mode Timing SpecificationsDS5001FP Expanded DATA-MEMORY Write Cycle External Clock Timing External Clock DrivePower Cycle Timing Power Cycle TimeSerial Port TIMING, Mode BYTE-WIDE ADDRESS/DATA BUS Timing BYTE-WIDE BUS Timing Parameter Symbol MIN MAX UnitsAC Characteristics AC CHARACTERISTICS, DMARPC Timing Mode DS5001FP PIN Mqfp PIN Mqfp Revision History