Cypress CY7C107BN, CY7C1007BN Package Diagrams, Lead 400-Mil Molded SOJ, Lead 300-Mil Molded SOJ

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CY7C107BN

CY7C1007BN

Package Diagrams

28-Lead (400-Mil) Molded SOJ (51-85032)

PIN 1 I.D

14

1

 

 

 

 

 

DIMENSIONS IN INCHES

MIN.

 

 

 

 

 

 

 

 

.435

 

 

 

 

MAX.

.395

.445

 

 

 

.405

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

15

.050 TYP.

28

.720

.730

.026

.032

.015

.020

 

SEATING PLANE

.128

 

.148

.007

 

.013

 

0.004

 

.360

.025 MIN.

.380

 

51-85032.*B

 

51-85032-*B

28-Lead (300-Mil) Molded SOJ (51-85031)

NOTE :

1.JEDEC STD REF MO088

2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.006 in (0.152 mm) PER SIDE

3. DIMENSIONS IN INCHES

MIN.

 

 

 

 

MAX.

 

 

A

 

PIN 1 ID

 

DETAIL

 

 

EXTERNAL LEAD DESIGN

14

1

 

 

 

 

0.291

0.330

 

 

 

0.300

 

 

 

0.350

 

 

 

 

 

 

 

 

 

 

0.026

 

 

 

0.013

0.032

15

28

 

 

 

0.019

0.014

 

 

 

 

 

 

 

0.020

 

 

 

OPTION 1

OPTION 2

0.697

 

SEATING PLANE

 

 

0.713

 

 

 

 

 

 

 

 

0.120

 

 

0.007

 

0.140

 

 

A

 

0.004

 

0.013

 

0.262

 

0.050

 

 

0.272

51-85031-*C

TYP.

0.025 MIN.

 

 

 

 

 

 

All product or company names mentioned in this document may be the trademarks of their respective holders.

Document #: 001-06426 Rev. **

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© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Contents Pin Configuration FeaturesLogic Block Diagram Functional DescriptionElectrical Characteristics Over the Operating Range Maximum RatingsCapacitance4 Switching Characteristics5 Over the Operating Range AC Test Loads and WaveformsParameter Description Unit Min Max Switching Waveforms Read Cycle NoWrite Cycle No CE Controlled13 Truth Table Mode PowerOrdering Code Package Package Type Operating Diagram Range Ordering InformationPackage Diagrams Lead 400-Mil Molded SOJLead 300-Mil Molded SOJ Issue Orig. Description of Change Date 423847 New Data SheetDocument History

CY7C107BN, CY7C1007BN specifications

The Cypress CY7C107BN and CY7C1007BN are versatile synchronous static RAM (SRAM) devices that are widely used in various electronic applications, including networking, telecommunications, and consumer electronics. These devices are designed to meet the demands for high-speed memory accesses while providing low power consumption and high reliability, making them an ideal choice for designers seeking efficient memory solutions.

One of the main features of the CY7C107BN and CY7C1007BN is their high-speed access time. Both chips offer access times as fast as 10 nanoseconds, which allows devices using these memories to process data at impressive rates. This speed is particularly beneficial for applications requiring rapid read and write operations, such as cache memory or data buffering in high-performance computing environments.

In terms of memory density, the CY7C107BN offers a capacity of 1 Megabit, while the CY7C1007BN provides a greater capacity of 2 Megabits. This makes both chips suitable for varying storage requirements, allowing designers to select the appropriate size based on their application's memory needs. The memory architecture of these SRAMs consists of a static cell design, which ensures data retention without the need for refresh cycles, contrasting with dynamic RAM (DRAM) technologies. This characteristic not only simplifies system design but enhances performance and reliability.

The Cypress SRAMs are implemented in a single 5-volt power supply range, facilitating compatibility with a wide range of existing systems. Their low standby current consumption is another notable advantage, enabling battery-operated devices to operate for extended periods without significant power drain.

Moreover, the CY7C107BN and CY7C1007BN incorporate advanced CMOS technology, which contributes to their low power dissipation and high noise immunity. Designers appreciate the integration and ease of implementation made possible by 10 leading-edge package options available for these devices.

Additionally, both memory chips support common SRAM functionalities, including asynchronous read and write controls, enabling straightforward interfacing with microcontrollers and digital signal processors. With built-in features for write enable, output enable, and chip select, these SRAMs facilitate flexible memory management and control in diverse applications.

In summary, the Cypress CY7C107BN and CY7C1007BN SRAMs represent robust and efficient memory solutions that offer high speeds, low power consumption, and significant reliability. Their features make them suitable for a wide range of electronic applications, solidifying their position as trusted components in the evolving landscape of semiconductor technologies.