Cypress 7C185-15 Package Diagrams, Lead 300-Mil Molded DIP P21, Lead 300-Mil Molded Soic S21

Page 9

CY7C185

Package Diagrams

28-Lead (300-Mil) Molded DIP P21

51-85014-*B

28-Lead (300-Mil) Molded SOIC S21

51-85026-*A

Document #: 38-05043 Rev. *A

Page 9 of 11

Image 9
Contents Logic Block Diagram FeaturesFunctional Description1 Selection Guide2Maximum Ratings Electrical Characteristics Over the Operating RangeOperating Range Ambient RangeCapacitance5 AC Test Loads and WaveformsParameter Description Test Conditions Max Unit High to Low Z Switching Characteristics Over the Operating Range6Switching Waveforms Read Cycle No.110,11Write Cycle No WE Controlled11,13 Write Cycle No WE Controlled, OE LOW13,14,15,16 Rite Cycle No CE Controlled13,14,15Normalized Supply Current Typical DC and AC CharacteristicsTruth Table Address DesignatorsOrdering Information Package Diagrams Lead 300-Mil Molded DIP P21Lead 300-Mil Molded Soic S21 Lead 300-Mil Molded SOJ Date Change Description of Change Document History

7C185-15, 7C185-20, 7C185-25, 7C185-35 specifications

Cypress 7C185 series, comprising models 7C185-35, 7C185-25, 7C185-20, and 7C185-15, represents a significant leap in advanced semiconductor technology tailored for various applications in the electronics industry. These models are part of a broader family of programmable devices featuring a blend of flash and SRAM, designed to meet the dynamic needs of modern digital systems.

One of the main features across the 7C185 series is the impressive memory density and flexibility they offer. With capacities that allow for substantial code storage and efficient data handling, these devices cater well to applications in embedded systems, automotive controls, and industrial automation. The combination of flash memory technology with SRAM provides users the ability to easily reprogram devices, enabling quick iterations in design and functionality without the need for extensive hardware changes.

In terms of technology, Cypress has incorporated cutting-edge process nodes that result in lower power consumption and enhanced performance. This is notably crucial in battery-operated applications where efficiency is paramount. Furthermore, these chips support low-voltage operation, allowing them to seamlessly integrate into various low-power applications without sacrificing performance reliability.

Another characteristic of the Cypress 7C185 series is their robust security features. Embedded security protocols and encryption capabilities make these devices suitable for applications requiring secure data storage and transmission, fulfilling the modern demand for cybersecurity in IoT devices.

The architecture of these devices is optimized for high-speed access and quick response times, which is essential in applications that require real-time data processing. Enhanced I/O options, including multiple communication interfaces, facilitate connectivity with a broad range of peripherals and systems, making integration into existing infrastructures smoother.

Additionally, these models come with built-in support for various programming standards and methodologies, simplifying the development process for engineers. They also provide extensive support documentation and development tools from Cypress, enabling developers to leverage the full potential of the device easily.

In summary, the Cypress 7C185-35, 7C185-25, 7C185-20, and 7C185-15 chips embody a blend of high memory capacity, energy efficiency, robust security, and versatile integration capabilities, making them a reliable choice for today's complex electronic applications. Their advanced features position them as pivotal components in driving innovation across various sectors, including consumer electronics, automotive, and industrial automation.