Zhone Technologies Copper-Based Ethernet Bonding copper circuits for increased Ethernet bandwidth

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Bonding copper circuits for increased Ethernet bandwidth

The key innovation in EFM is the loop bonding of multiple copper circuits to provide increased bandwidth. By intelligently distributing traffic across multiple circuits, using very high-efficiency hardware processing, these multiple circuits appear to the network as a single, high-bandwidth link, overcoming the limitations of individual copper circuits.

Two methods of hardware-based bonding are in widespread use, as described below. Zhone offers both forms of bonding to provide maximum flexibility and cost-effectiveness.

802.3ah EFM

The IEEE 802.3ah standard for EFM, covering both fiber and copper Ethernet applications, specifies the type of encoding used, bonding methodology for copper, and OAM (Operations, Administration and Maintenance) support. Zhone supports 802.3ah in our Ethernet aggregation line cards and EtherXtend SHDSL EAD products.

HDLC-based Ethernet over Copper Bonding

HDLC-based bonding provides physical layer (PHY) bonding of DS1 / E1 / DS3 and SHDSL circuits for highly efficient and reliable bandwidth gain. Widely deployed and field proven, HDLC-based bonding is ideally suited for point-to-point and aggrega- tion applications where simplicity and reliability are critical. Zhone supports HDLC- based Ethernet over copper bonding technology in all of our EADs and aggregation line cards.

Grande Communications

Makes Carrier Ethernet

a Big Success

“The addition of Zhone’s Ethernet access technology in combination with Grande’s extensive copper and fiber network creates an unparalleled delivery vehicle. The unique ability to offer true 802.1 Q-in-Q Transparent LAN Service with the requisite Layer 2 and 3 controls is an important component of this product offering for Grande.”

Lamar Horton,

Director Network Engineering

Grande Communications

Zhone Delivers Higher Bandwidth to Netmedia

“Using Zhone's Ethernet over Copper solutions with both E1 and SHDSL lines has enabled delivery of higher bandwidth Ethernet business services in Finland over existing copper lines, thereby creating new and profitable Ethernet business services by re-using existing plant.”

Martin Sten, Founder

Netmedia, Finland

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Contents Copper-Based Ethernet in the First Mile EFM Product GuideEthernet Everywhere Need high-bandwidth Ethernet service over existing copper?Bonding copper circuits for increased Ethernet bandwidth EtherXtend LT-DS3 Ethernet Access Devices EADs Product CategoryEasy, Proven, Deployed EtherXtend EtherXtend LTProduct Category Ethernet Access Device Selection GuideIPD Dslam EFM AggregationMALC-EFM DslamEAD to Aggregation Platform Interoperability Aggregation PlatformsNorth America Access for a Converging World