BIXOLON SRP-350 Precaution for Electrostatically Sensitive Devices ESDs, Operational Precautions

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SRP-350/352plusA&C

1-3 Precaution for Electrostatically Sensitive Devices (ESDs)

1.Some semiconductor (solid state) devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices (ESDs); examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damaged caused by static electricity.

2.Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power-this is an Electric shock precaution.)

3.After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge.

4.Do not use freon-propelled chemical. These can generate electrical charges that damage ESDs.

5.Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

6.Use only an anti-static solder removal device. Many solder removal devices are not rated as anti-static; these can accumulate sufficient electrical charge to damage ESDs.

7.Do not remove a replacement ESD from its protective package until you are ready to install it.

Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.

8.Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the device will be installed.

9.Minimize body motions when handling unpacked replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damaged an ESD.

1-4 Operational Precautions

1.The heating element of the printer mechanism’s thermal head and the driver IC are easily damaged. Never allow these components to come into contact with metal or other hard objects.

2.Never touch the printer mechanism’s heating element with your hand. Doing so can damage the heating element and affect proper operation.

3.The head and motor areas are very hot during and immediately after printing. Do not touch components in these areas directly with your hand.

4.Do not use any paper other than these specified in this manual otherwise print head reliability and print quality are affected adversely.

5.Thermal paper starts to color at around 70ºC. Take care to protect unused and printed thermal paper against the affects of heat, light and characters on the paper to feed.

6.Take the roll paper out of the printer when you will not use the printer for a long time in a high temperature and humidity environment.

Rev. 2.01

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Contents Service Manual SRP-350/352plusA&CThermal Printer Rev Table of Contents SRP-350/352plusA&C7. Troubleshooting 5. Disassembly and Assembly6. Adjustments and Maintenance 4. Hardware1. Precaution Segment 1-1 Safety Precautions1-2 Servicing Precaution a Remove or reinstall any component or assembly1-3 Precaution for Electrostatically Sensitive Devices ESDs 1-4 Operational Precautions1. Some semiconductor solid state devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices ESDs examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damaged caused by static electricity 2-1-1 AC Adapter Installation 2. Installation and Operation2-1 Installation 2-1-2 Interface Cable Installation2-1-5 Wall Mount Installation SRP-350/352plusA&C 2-2 Operation 2-2-1 Setting the DIP switches2-2-2 Setting the DIP switch RS-232C Serial Interface 2-2-3 Setting the DIP switch IEEE1284 Parallel, USB Interface ※ Auto Cutter Enable / Disable selection2-2-4 Hexadecimal Dumping 2-2-5 The self Test ModeFigure 3-13 The Self-Test Sheet 2-2-6 Setting the Memory Switches SRP-350/352plusA&C 3-1-1 Printer Dimensions mm 3. Product Specifications3-1 Appearance 3-1-2 AC Adapter Dimensions mm3-1-3 Feature Locations-SRP-350/352plusA/C TYPE SRP-350/352plusCOP IEEE1284 Parallel Communication 3-2 General SpecificationsSRP-350/352plusCOS RS-232 Serial Communication SRP-350/352plusCO USB Communication3-3-2 Character Specification 3-3 Thermal Printer Specifications3-3-1 Printer Specification Description※ Note 3-3-3 Paper Specification3-3-4 Reliability and Environment Specification PD 160R3-3-6 TPH Thermal Printer Head Specification 1 180dpi 3-3-5 Printable Area3-3-7 Other Component Specification 3-4 SMPS Specifications 3-4-1 SMPS Switching Mode Power Supply Specification3-4-2 SMPS Output Connector 3-5 Interface Specifications 3-5-1 RS-232C Serial Interface 3-5-1a Specification3-5-1b RS-232C I/F Cable Printer 3-5-1d Signal Description3-5-1c Cable Connection Host3-5-1f S/W Flow Control 2-5-2a Forward Mode Specification Compatibility mode3-5-1e H/W Flow Control ※ Note Refer to the Operation Manual about XON/XOFF flow controlnAck 3-5-2c Signal Specification Compatibility/Nibble/Byte mode3-5-2c IEEE1284 I/F Cable Busy3-5-3 USB2.0 Interface 3-5-3a Specification3-5-3b Signal Description 3-5-3c Cable3-5-4d Construction ※ Note Minimum conductor construction must be stranded tinned copper Series A ConnectorsSeries B Connectors From the3-6-1 Drawer Cable 3-6 Cash Drawer Specifications※ Note +24V is always output through pin 4 during power on 3-6-2 Cable Connection4-1 Wiring Diagram 4. HardwareFigure 4-1 Board Wiring Diagram 4-2 Block Diagram Figure 4-2 Block Diagram4 CPU, Flesh, SRAM, Reset Voltage +3.3V 4-3 Special Circuit Descriptions4-3-1 Power Circuit VOLTAGEFigure 4-4 Reset Block Diagram Figure 4-5 Reset Waveform 4-3-2 RESET CircuitReset signal is signal in order to start-up CPU under Power-on ASM811 REUSF-T4-3-3 Buzzer and Cash Drawer Circuits 1 Buzzer Driving Circuit 2 Cash Drawer Driving Circuit4-3-4 I/F PBA Detect Block Diagram 4-3-5 RS-232C Communication Block DiagramUPD70F3107 4-3-6 Parallel Communication Block Diagram 4-3-7 USB Communication Block Diagram4-3-8 DIP Switch Circuit STROBE1 DATA#1,2LATCH 4-3-9 Thermal Printer Head Circuit1 Scrw 2 Brkt Dip Switch 3 Case Lower 5. Disassembly and Assembly5-1 Case lower block 4 Foot Rubber5 PCB Serial Parallel 8 Screw 1 Screw 2 Brkt PCB6 Main PCB Screw1.Remove the two screws 5-2 Case Upper block1.Push the button to open the Cove Open. 2.Remove the four screws 3.Remove the three screws. 4.Separate the Manual cutter from4 Brkt-Hook 3 Screw Roller Platen Assembly1 Spring Hook 1.Remove the E-Ring. 2.Separate the Spring tension, the4 Screw 5-3 Frame block3 Cover Housing 1 Screw1.Remove the screw 4 Screw 7 ConnectorSpring TPH 5.Separate the Connector from the Heat-sink 2 Heatsink Assy 1 ScrewWasher 1 Screw 2 Frame Main 3 Brkt PCB 4 Power SwitchFrame Main Slip6. Adjustments and Maintenance 6-1 Adjustment6-1-1 Remaining Roll Paper Adjustment 6-1-2 Paper Jam 6-2 Maintenance ※ Caution Turn off the printer power before cleaning7. Troubleshooting 7-1 Power ProblemOk? On SMPS 7-2 System Problem 7-3 Panel PBA and Sensor Problem 7-4 Thermal Printer Head and Feed Motor Problem 7-5 Auto Cutter and Drawer Problem 7-6 Dip S/W and I/F PBA Select Problem Input Ok?Select Ok? 7-7 RS-232C Serial Communication Problem 7-8 IEEE-1284 Parallel Communication Problem Failure? 7-9 USB2.0 Communication ProblemMain PBA I/F Reverse Mode