ADC 75 Ohm Interconnect manual Module System, Ohm Interconnect High-Density Configuration

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Digital Monitor Module System

75 Ohm Interconnect

High-Density Configuration

Module System

Features:

Improved circuit density by 20%; 352 circuits in fully loaded bay

Cable bars reduce cable congestion and simplify maintenance

Circuit designation label door ensures proper cable routing and identification

Bay equipped with four vertical cabling channels, cable troughs, and equipment cable tie-down bars for high density cable management

Zone 4 earthquake-rated equal-flange rack with EIA mounting spacing

D3C-0016HD

Front View

1 2 / 0 6 • 1 0 3 9 7 8 A E Digital Monitor

O r d e r i n g I n f o r m a t i o n

Description

Dimensions (HxWxD)

Ordering Number

 

 

 

Unloaded Pair of Dual Chassis

88 x 236 x 165 mm

D3C-0016HD

accomodates up to 16 modules in two, eight-position chassis

(3.5" x 9.3" x 6.5")

 

 

 

 

600 mm Dual Skeleton Bay

2200 x 600 x 250 mm

IBC-D3C001

accomodates up to 11 dual chassis

(86.7" x 23.6" x 23.6")

 

 

 

 

IBC-D3001

IBC-D3001

Front View

Side View

w w w . a d c . c o m

+ 1 - 9 5 2 - 9 3 8 - 8 0 8 0

1 - 8 0 0 - 3 6 6 - 3 8 9 1

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Contents Features Ohm Interconnect0 6 1 0 3 9 7 8 a E Digital Monitor Module System Ohm Interconnect ApplicationHigh-Density Configuration Ohm Interconnect ConfigurationsStandard Configuration ModulesDescription IN/OUT Connector Locations Catalog Number Ohm Interconnect ModulesMonitor Module System Ohm Interconnect Standard ConfigurationDescription Dimensions HxWxD Ordering Number 6 1 0 3 9 7 8 a E DigitalOhm Interconnect High-Density Configuration Module System0 6 1 0 3 9 7 8 a E Digital Monitor Ohm Interconnect Wall-Mount Box Specifications