LG Electronics 32LC2D(B) BLOCK DIAGRAMMain, TDFB-G236P DVB/PAL, FFC Wafer, 74LCX244, STi5100

Page 30
BLOCK DIAGRAM(Main)

BLOCK DIAGRAM(Main)

PDP modul e D/L

SDA,SCL

Wafer to PDP modul e

Hudson

24bit

 

 

 

 

 

 

 

 

V/YC Sub

 

Wafer

 

 

 

 

 

 

 

 

 

 

FFC

 

24bit

RGB t Scar

 

 

24bit

YPbPr Comp

 

 

 

 

 

RGB_PC

 

 

 

 

 

 

 

Fan

 

 

 

PDF

l Contro Fan

 

 

 

 

LVDS31P

 

BRI_INV

Cortez

 

 

 

 

PWM, AI, 10bit, : LCD

 

 

ation nic commu Uart

 

 

 

TS Tuner

 

 

 

 

 

 

 

 

 

 

 

 

Wafer

 

 

 

 

 

 

 

 

 

 

 

FFC

 

24bit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

rd Reco 8Pin

 

 

 

FFC Wafer

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

V/YC Main

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VLR out DTV

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OUT

 

24bit

 

 

 

 

 

 

 

 

 

DTV out SPDIF

SPDIF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MSP out SPDIF

 

 

 

 

 

 

 

 

 

CI SLOT

 

 

 

 

 

 

 

 

 

TDFB-G236P DVB/PAL

 

 

 

 

 

 

 

 

 

 

 

 

 

74LCX244

MUX

 

 

 

CI TS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TS IN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

8bit(656),27M Hz,I2S

24bit

Sil9012 TMDS Rx (HDCP)

8bit

HDMI

STi5100

ation nic commu Uart

Hz,I2S 8bit(656),27M

out SPDIF

VLR out DTV

3 State Buffer

rol cont-3state

- 30 -

Page 29 Page 31
Image 30
Page 29 Page 31
Contents BEFORE SERVICING THE CHASSIS READ THE SAFETY PRECAUTIONS IN THIS MANUALCHASSIS LD61A FACTORY NAME 32LC2DB-EC/37LC2DB-EC/42LC2DB-EC SERVICE MANUALPRODUCT SAFETY CONTENTSCONTENTS SPECIFICATIONGeneral Guidance SAFETY PRECAUTIONSIMPORTANT SAFETY NOTICE Leakage Current Hot Check circuitSERVICING PRECAUTIONS Electrostatically Sensitive ES DevicesSmall-Signal Discrete Transistor Removal/Replacement IC Remove/ReplacementReplacement Power Output, Transistor Device Removal/ReplacementSPECIFICATION 1.General SpecificationTV2. General Specification reatment of the front polarizer3.Optical FeatureLCD Module 4.Component Video Input Y, PB, PR5. RGB PC INPUT Mode Table 6. RGB DTV INPUT Mode TableRGB-PC EDID DATA 7. HDMI INPUT Mode Table 8. HDMI DTV Mode TableHDMI EDID DATA 32LC2D 7. Mechanical specification8. Mechanical specification Table 1 Scart Arrangement 1.Full ScartTable 2 Scart Arrangement 2.Half Scart 1. Application Range ADJUSTMENT INSTRUCTION2. Specification 3. Channel MemoryBefore AV ADC Calibration, should be executed the 5. Select method of Panel size6. ADC Calibration Panel size selectionCase1 EC and FC model use PAL-BGDHI composite signal 7. White BalanceBefore White-balance, the AV ADC should be done Cool11000K - x 0.274±0.003, y 0.286±0.003SVC REMOCON FUNTIONTROUBLESHOOTING No image Is the input cable attached?No image PASS No image No image No image No image No image AV4/S-Video L/R signal TROUBLESHOOTING AV1, 2, 3, 4/S-VideoVolume level Of AV1,AV2 ,AV3TROUBLESHOOTING DTV/HDMI-Audio TROUBLESHOOTING RF/Component/PC Wafer BLOCK DIAGRAMMainTDFB-G236P DVB/PAL FFC WaferCXA2069Q BLOCK DIAGRAMJackAUDIO/VI DEO SW Sound processorEXPLODED VIEW32LC2D 010 020050EXPLODED VIEW PARTS LIST32LC2D DESCRIPTIONEXPLODED VIEW37LC2D EXPLODED VIEW PARTS LIST37LC2D EXPLODED VIEW42LC2D 020080 130030 150 090EXPLODED VIEW PARTS LIST42LC2D REPLACEMENT PARTS LIST MAIN BOARDCAPACITOR DATE 2006. 05 DATE 2006. 05 DATE 2006. 05 DIODEs COIL & CORE & INDUCTOR TRANSISTOR RESISTORsDATE 2006. 05 DATE 2006. 05 DATE 2006. 05 DATE 2006. 05 OTHERs JACK BOARDDATE 2006. 05 DIODEs COIL & CORE & INDUCTORTRANSISTOR RESISTORsDATE 2006. 05 CONTROL BOARD SIDE A/V BOARD IR/LED BOARDPage Page Page Page Page P/NO 38289S0043 Printed in Korea
Top Page Image Contents