LG Electronics 32LT360C-ZA GP3S7LR, 20110324, Sflash, MX25L8006EM2I-12G, IC1401-*1, R1403

Page 35
IC1401

+3.5V_ST

 

 

+3.5V_ST

 

 

 

 

 

 

S_FLASH_MAIN_MACRONIX

 

 

 

 

 

 

OPT

R1404

 

4.7K

IC1401

 

 

+3.5V_ST

 

MX25L8006EM2I-12G

 

 

 

 

 

CS#

VCC

C1401

 

OPT

R1403

10K

/SPI_CS

1

8

 

 

 

 

 

 

 

 

0 . 1 u F

 

 

 

 

 

SO/SIO1

HOLD#

 

 

 

 

 

SPI_SDO

2

7

 

 

 

 

 

 

WP#

SCLK

 

/FLASH_WP

 

 

 

 

3

6

SPI_SCK

 

 

 

 

 

GND

S I / S I O 0

R1405

 

 

 

C

 

33

 

 

 

 

 

4

5

SPI_SDI

R1401

B

 

 

Q1401

 

 

 

OPT 0

 

 

 

KRC103S

 

 

 

 

 

E

OPT

 

 

 

 

 

 

 

 

 

 

S_FLASH_MAIN_WINBOND

 

 

 

 

 

IC1401-*1

 

 

W25Q80BVSSIG

 

 

 

 

 

 

VCC

 

 

 

 

 

 

 

CS

 

1

8

 

 

 

 

 

 

 

 

DO[IO1]

 

 

 

 

 

2

7

 

HOLD[IO3]

 

 

 

 

 

 

 

 

%WP[IO2]

3

6

CLK

 

 

 

 

 

 

 

 

 

GND

4

5

D I [ I O 0 ]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

 

 

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

 

 

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

GP3_S7LR

20110324

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

 

 

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SFLASH

13

Copyright © 2012 LG Electronics. Inc. All rights reserved.

LGE Internal Use Only

Only for training and service purposes

 

Image 35
Contents http//eic.lgservice.com SERVICE MANUALREAD THE SAFETY PRECAUTIONS IN THIS MANUAL http//aic.lgservice.comLGE Internal Use Only Only for training and service purposesCopyright LG Electronics. Inc. All rights reservedLeakage Current Cold CheckAntenna Cold Check SAFETY PRECAUTIONSGeneral Guidance Before returning the receiver to the customerElectrostatically Sensitive ES Devices SERVICING PRECAUTIONSRemoval IC Remove/ReplacementReplacement Small-Signal Discrete Transistor Removal/Replacement3. Test method SPECIFICATION4. Model General Specification 1. Application range5.1. Component Input Y, CB/PB, CR/PR 5. Video resolutions 2DPCDVI 5.2. RGB Input PC5.3. HDMI InputPC/DTV 3. Main PCB check process ADJUSTMENT INSTRUCTION1. Application Range 2. Designation3.2. Function Check 4. Total Assembly line process4.1. Adjustment Preparation 3.1. ADC Process4.3 DDC EDID Write HDMI 256Byte Manual W/B process using adjust Remote control4.4. EDID data 4.2. DDC EDID Write RGB 128ByteAdjust sequence 4.5. V-COM AdjustOnly LGDM+S Module4.6. Outgoing condition Configuration Why need Vcom adjustment?5.3. Method & notice 5. Model name & Serial number D/L5.1. Signal Table 5.2. Comand SetCI+ Key Value 6. CI+ Key Download method6.1. Download Procedure 2. Digital TV Video TROUBLE SHOOTING1. Check the booting Voltage 4. AV Video 3. Analog TV Video6. HDMI Video 5. RGB Video8. TV Audio 7. Audio of All iput10. RGB Audio 9. AV AudioRear DIAGRAMBLOCK and service purposesEXPLODED VIEW Copyright 2012 LG Electronics. Inc. All rights reserved GP3S7LR20110511 COMP CVBS+2.5V/+1.8V FROM LIPS & POWER B/DPowerDET +1.5VDDRIR OUT CONTROL IR & LEDUSBOCPDIODE USBDIODESGP2R 20101023D803 AVRL161A1R1NT IC1202 H5TQ1G63DFR-H9C S7LRDIVXMS10IC1201 IC101 LGE2112-T8TUNERL P4RGLOBALTUNERBLOCKGP3S7LR NTP7400 IC501NTP-7500L 20110324REARJACK Rear AVF u l l S c a r t SIDE COMPONENT PHONE JACK Page RS232C 12V EXT PowerOutDC DC CONVERTER +12VONLY PSU For External power Pol - change LVDS for large inchMIRROR Pol - change MIRRORIC1401-*1 SFLASHIC1401 MX25L8006EM2I-12GSPEAKER OUT JACK EXTSPEAKERAMPPCMCI CI RegionOption name of this page CI SLOT because of Hong Kong