Hitachi 60SBX78B, 50SBX78B service manual Use Solding Iron to Pry Leads

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General Soldering Guidelines

1.Use a grounded-tip, low-wattage soldering iron and

appropriate tip size and shape that will maintain tip temperature within the range 500°F to 600°F.

2.Use an appropriate gauge of resin-core solder composed of 60 parts tin/40 parts lead.

3.Keep the soldering iron tip clean and well-tinned.

4.Thoroughly clean the surfaces to be soldered. Use a small wire-bristle (0.5 inch or 1.25 cm) brush with a metal

handle. Do not use freon-propelled spray-on cleaners.

5.Use the following desoldering technique.

a.Allow the soldering iron tip to reach normal temperature (500°F to 600°F).

b.Heat the component lead until the solder melts. Quickly draw away the melted solder with an anti-static,

suction-type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6.Use the following soldering technique.

a.Allow the soldering iron tip to reach normal temperature (500°F to 600°F).

b.First, hold the soldering iron tip and solder strand against the component lead until the solder melts.

c.Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil or components.

d.Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

Use Solding Iron to Pry Leads

IC Removal/Replacement

Some Hitachi unitized chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1.Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2.Draw away the melted solder with an anti-static suction- type solder removal device (or with solder braid) before removing the IC.

Replacement

1.Carefully insert the replacement IC in the circuit board.

2.Carefully bend each IC lead against the circuit foil pad and solder it.

3.Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to areas.)

“Small-signal” Discrete Transistor Removal/Replacement

1.Remove the defective transistor by clipping its leads as close as possible to the component body.

2.Bend into a “U” shape the end of each of three leads remaining on the circuit board.

3.Bend into a “U” shape the replacement transistor leads.

4.Connect to replacement transistor leads to the

corresponding leads extending from the circuit board and crimp the “U” with long nose pliers to insure metal to metal contact, then solder each connection.

Power Output Transistor Devices Removal/Replacements

1.Heat and remove all solder from around the transistor leads.

2.Remove the heatsink mounting screw (if so equipped).

3.Carefully remove the transistor from the circuit board.

4.Insert new transistor in circuit board.

5.Solder each transistor lead, and clip off excess lead.

6.Replace heatsink.

Diode Removal/Ret>lacement

1.Remove defective diode by clipping its leads as close as possible to diode body.

2.Bend the two remaining leads perpendicularly to the circuit board.

3.Observing diode polarity, wrap each lead of the new

diode around the corresponding lead on the circuit board.

4.Securely crimp each connection and solder it.

5.Inspect (on the circuit board copper side) the solder joints of the two “original leads”. If they are not shiny, reheat them and, if necessary, apply additional solder.

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Contents Projection Color Television ContentsSafety Notice USE Isolation Transformer When Servicing Leakage Current for Appliances and Underwriters Safety PrecautionsDetailing X-radiation Shield TubePage Immediately before handling any semiconductor Servicing PrecautionsUse Solding Iron to Pry Leads Bare Jumper Insulated Jumper WireDetermine the positions Soldering Iron Iron wireTechnical Cautions IPOWER/DEFLECTION PWBStereo Audio Output Audio Output PowerDimension 50SBX78B Audio InputTransmitter General InformationBrightness Color Tint Customized Picture and Sound AdjustmentsCursor COLOR, TintBass IllGuide TV Guide PLUS+VCR Example StepOutside antenna or Cable TV coaxial cable SelectAudio RecallVCR #I 0Set U END of SET UP Covering the high voltage output FBTRemark Make sure the silicon cover isCRT AdjustmentCPT Adjustment procedure Adjustable data Others Fixed data be careful not to changeWhen Exchanging Time Tour at first Power on byContrast Half Brightness Minimum Final Assembly AdjustmentSub brightness adjustment White balance adjustmentMrn Repeat for P832 and ROM6 Green, P862 and ROM4 for RedPoint FrontrearCenter Front Rear Front Rear+2 mm Vertical size adjustment R630Twa4 +- $$i Horizontal size adjustment R603 Adjustment preparationConvergence first. Press front panel Magic Observing PointsThis can eliminate the need for a complete Before JIG Screen SpecificationAfter ROM Write Convergence point adjustmentDigital Convergence Remote Control Then Press RECALL’GUIDE+ OSD CRT, cabinet locations Adjustment PointROM8 ROM6 ROM4 SURROUNDP.W.B.SIGNALSUB B. VMMain Chassis Signal P.W.B IsciiMain Chassis Power/Deflection P.W.BIXI CPT R G B, Focus Pack, Control P.W.B OoorTvsv TroubleshootingYes OFFNo.~ Voltage at pin 5 Yes E991 blown YesYes Normal Normal Abnormal 0517 Q516Does on-screen 1501, 1903, 1001 Q108, Q109, QllO, Q008U102 Yes Vcc Sv, BP 5v, T3u102 Eception impossible with snow noise YesCl902 Defective SynchronizationPRT G PRT RU101 No SoundNtsc DCU Repair TableTV ON/OFF Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Exploded MEW Symbol Part Replacement Parts ListIooopfkb 50V Tape ProductComponents 5OV Symbol PartIEL TapeChip Symbol Product ServiceCSE3 Symbol Part Light DescriptionRmpgogd MTZJ-ICircuits Part SymbolTuner Unit 5MA UkdgCoil Part Description1OUH IoouhReceiver Through Improper Servicing QAI 1KJ Tape ROA2 ROP7 Replacement Parts List With a n Have special OOK-JB OK-JB SRD1/2P-SSRD1/2P-B IOK-JBRAC2 Chip1KJ MINI-CHIPIOK-JQ OHMRkio RgiiRlio Symbol Part NO.NO RY50 Symbol EF05951

60SBX78B, 50SBX78B specifications

The Hitachi 50SBX78B and 60SBX78B are advanced plasma televisions that represent the pinnacle of display technology in their respective categories. These models bring together innovative features, cutting-edge technology, and sleek design, ensuring an immersive viewing experience for consumers.

One of the standout characteristics of the Hitachi 50SBX78B and 60SBX78B is their screen size, with the 50-inch model catering to smaller spaces while the 60-inch offers a more cinematic experience. Both models boast impressive Full HD resolution, delivering a crisp and vibrant picture quality that enhances any viewing experience, whether it be movies, sports, or gaming.

The technology behind these televisions includes Hitachi's proprietary image processing technology, which optimizes picture quality by minimizing noise and enhancing color accuracy. This leads to deeper blacks and brighter whites, ensuring that every scene is rendered with stunning detail. The Plasmavision technology further enhances the black levels and contrast ratios, making images pop off the screen.

In addition to superior image quality, both models come equipped with a variety of connectivity options. Multiple HDMI inputs allow users to easily connect various devices such as gaming consoles, Blu-ray players, and streaming devices. The inclusion of USB ports facilitates easy viewing of photos and videos stored on external drives.

Moreover, Hitachi televisions have integrated audio technologies that enhance the overall viewing experience. The built-in speakers provide clear sound, while the digital audio output allows for connection to external sound systems, giving consumers the flexibility to customize their audio experience.

Energy efficiency is also a notable feature of the Hitachi 50SBX78B and 60SBX78B models. They are designed to consume less power than traditional televisions, aligning with the growing demand for environmentally friendly electronics. This not only reduces electricity bills but also minimizes the carbon footprint.

The sleek and modern design of these plasma televisions makes them an attractive addition to any home décor. The slim bezel offers a larger screen-to-body ratio, maximizing the viewing area while maintaining an elegant appearance.

In summary, the Hitachi 50SBX78B and 60SBX78B offer a compelling package of features, technologies, and characteristics that cater to the needs of modern viewers. With superior image quality, versatile connectivity, and energy efficiency, these televisions are designed to deliver an exceptional home entertainment experience.
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