INDENTIFICATION:
Regardless of special logo (not always indicated)
One must treat all sets from 1.1.2005 onwards, according next rules.
Important note: In fact also products a little older can also be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be respected by the workshop during a repair:
ξUse only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle.
ξUse only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C, o To stabilize the adjusted temperature at the
solder-tip
o To exchange solder-tips for different applications.
ξAdjust your solder tool so that a temperature around 360°C – 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat.
ξMix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed
solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the
solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).
ξUse only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies.
ξSpecial information for BGA-ICs:
-always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use highest lead-free temperature profile, in case of doubt)
-lead free BGA-ICs will be delivered in so-called ‘dry-packaging’ (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. This will be communicated via AYS-website.
Do not re-use BGAs at all.
ξFor sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.
ξOn our website: www.atyourservice.ce.Philips.com
You find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets
You will find this and more technical information within the “magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.
