Waveforms, Common note on Printed Wiring Board

Common note on Printed Wiring Board:

•Y : parts extracted from the conductor side.

• : Pattern from the side which enables seeing. (The other layer’s patterns are not indicated.)

Caution:

Pattern face side: Parts on the pattern face side seen from the

(Side B) pattern face are indicated.

Parts face side: Parts on the parts face side seen from the

(Side A)

parts face are indicated.

•Main board is four-layer printed board.

However, the patterns of layers 2 and 3 have not been in- cluded in this diagrams.

*Replacement of IC801 on main board requires a special tool.

•Lead Layouts

surface

Lead layout of conventional IC

CSP (chip size package)

Common note on Schematic Diagram:

•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•% : indicates tolerance.

•C : panel designation.

Note:	Note:
The components identi-	Les composants identifiés par
fied by mark 0 or dotted	une marque 0 sont critiques
line with mark 0 are criti-	pour la sécurité.
cal for safety.	Ne les remplacer que par une
Replace only with part	piéce portant le numéro
number specified.	spécifié.

•A : B+ Line.

•Total current is measured with Minidisc installed.

•Power voltage is dc 3V and fed with regulated dc power supply from external power voltage jack.

•Voltage and waveforms are dc with respect to ground under no-signal conditions.

no mark : PB

( ) : REC

∗: Impossible to measure

•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

E : PB

k : REC (ANALOG)

l : REC (DIGITAL)

•Abbreviation

CND : Canadian model

MZ-R501/R501PC

Ver 1.1

• Waveforms

1100mV/DIV, 1µs/DIV

Approx. 220mVp-p

IC501 8 (IY) (PB mode)

2100V/DIV, 1µs/DIV

Approx. 220mVp-p

IC501 9 (IX) (PB mode)

3100mV/DIV, 1µs/DIV

Approx. 220mVp-p

IC501 q; (JX) (PB mode)

4100mV/DIV, 1µs/DIV

Approx. 220mVp-p

IC501 qa (JY) (PB mode)

520mV/DIV, 500ns/DIV

Approx. 35mVp-p

IC501 1 (TE) (PB mode)

6500mV/DIV, 500ns/DIV

Approx. 1.3Vp-p

IC501 ed(RF OUT) (PB mode)

710mV/DIV, 500ns/DIV

Approx. 20mVp-p

IC501 rs (FE) (PB mode)

81V/DIV, 2µs/DIV

2.4Vp-p

5.8µs

IC601 4 (CLK)

91V/DIV, 2µs/DIV

2.4Vp-p

5.8µs

IC901 th (CLK)

33 33